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 Freescale Semiconductor
Freescale Semiconductor, Inc...
General Release Specification
CSIC MCU Design Center Austin, Texas
(c) Freescale Semiconductor, Inc., 2004. All rights reserved.
NON-DISCLOSURE
January 16, 1997
AGREEMENT
MC68HC05RC17
REQUIRED
HC05RC17GRS/D REV. 2.0
Freescale Semiconductor, Inc. General Release Specifiation REQUIRED NON-DISCLOSURE
General Release Specification For More Information On This Product, Go to: www.freescale.com
Freescale Semiconductor, Inc...
AGREEMENT
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
List of Sections
Section 1. General Description . . . . . . . . . . . . . . . . . . . 15
Freescale Semiconductor, Inc...
Section 2. Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Section 3. Central Processor Unit (CPU) . . . . . . . . . . . . 33 Section 4, Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Section 5. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Section 6. Low-Power Modes . . . . . . . . . . . . . . . . . . . . 55 Section 7. Parallel Input/Output (I/O) . . . . . . . . . . . . . . 59 Section 8. Core Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Section 9. Carrier Modulator Transmitter (CMT) . . . . . . 69 Section 10. Phase-Locked Loop (PLL) Synthesizer . . . . 87 Section 11. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . 93 Section 12. Electrical Specifications . . . . . . . . . . . . . . 111 Section 13. Mechanical Specifications . . . . . . . . . . . 121 Section 14. Ordering Information . . . . . . . . . . . . . . . . 123 AGREEMENT NON-DISCLOSURE
MC68HC05RC17 -- Rev. 2.0 List of Sections For More Information On This Product, Go to: www.freescale.com
General Release Specification
REQUIRED
Freescale Semiconductor, Inc. List of Sections REQUIRED NON-DISCLOSURE
General Release Specification List of Sections For More Information On This Product, Go to: www.freescale.com
Freescale Semiconductor, Inc...
AGREEMENT
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
Table of Contents
Section 1. General Description
1.1 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Freescale Semiconductor, Inc...
1.3 1.4
Section 2. Memory
2.1 2.2 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
2.3 Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 2.3.1 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 2.3.2 ROM Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 2.3.3 RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
MC68HC05RC17 -- Rev. 2.0 Table of Contents For More Information On This Product, Go to: www.freescale.com
General Release Specification
NON-DISCLOSURE
1.5 Signal Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 1.5.1 VDD and VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 1.5.2 IRQ (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . .22 1.5.3 OSC1 and OSC2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 1.5.4 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 1.5.5 LPRST. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 1.5.6 IRO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 1.5.7 Port A (PA0-PA7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 1.5.8 Port B (PB0-PB7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 1.5.9 Port C (PC0-PC1 and PC4-PC7). . . . . . . . . . . . . . . . . . . .24 1.5.10 XFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.11 VDDSYN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
AGREEMENT
1.2
REQUIRED
Freescale Semiconductor, Inc. Table of Contents REQUIRED Section 3. Central Processor Unit (CPU)
3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 CPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Index Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Condition Code Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Stack Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Program Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Freescale Semiconductor, Inc...
AGREEMENT
Section 4. Interrupts
4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 4.10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 CPU Interrupt Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 Reset Interrupt Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Software Interrupt (SWI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Hardware Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 External Interrupt (IRQ/Port B Keyscan). . . . . . . . . . . . . . . . . .43 External Interrupt Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Carrier Modulator Transmitter Interrupt (CMT) . . . . . . . . . . . . .44 Core Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
NON-DISCLOSURE
Section 5. Resets
5.1 5.2 5.3 5.4 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 External Reset (RESET). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Low-Power External Reset (LPRST) . . . . . . . . . . . . . . . . . . . .50
General Release Specification Table of Contents For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Table of Contents
5.5 Internal Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 5.5.1 Power-On Reset (POR). . . . . . . . . . . . . . . . . . . . . . . . . . . .50 5.5.2 Computer Operating Properly Reset (COPR) . . . . . . . . . . .51 5.5.2.1 Resetting the COP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.5.2.2 COP During Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.5.2.3 COP During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.5.2.4 COP Watchdog Timer Considerations . . . . . . . . . . . . . . .52 5.5.2.5 COP Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 5.5.3 Illegal Address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Freescale Semiconductor, Inc...
Section 6. Low-Power Modes
6.1 6.2 6.3 6.4 6.5 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Wait Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Low-Power Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Section 7. Parallel Input/Output (I/O)
7.1 7.2 7.3 7.4 7.5 7.6 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Input/Output (I/O) Programming . . . . . . . . . . . . . . . . . . . . . . . .61 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Section 8. Core Timer
8.1 8.2 8.3 8.4 8.5 8.6
MC68HC05RC17 -- Rev. 2.0 Table of Contents For More Information On This Product, Go to: www.freescale.com
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Core Timer Control and Status Register. . . . . . . . . . . . . . . . . .65 Core Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . .67 Computer Operating Properly (COP) Reset . . . . . . . . . . . . . . .67 Timer During Wait Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
General Release Specification
NON-DISCLOSURE
AGREEMENT
REQUIRED
Freescale Semiconductor, Inc. Table of Contents REQUIRED Section 9. Carrier Modulator Transmitter (CMT)
9.1 9.2 9.3 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
9.4 Carrier Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 9.4.1 Time Counter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 9.4.2 Carrier Generator Data Registers . . . . . . . . . . . . . . . . . . . .74 9.5 Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 9.5.1 Time Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 9.5.2 FSK Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79 9.5.3 Extended Space Operation . . . . . . . . . . . . . . . . . . . . . . . . .80 9.5.3.1 End-of-Cycle (EOC) Interrupt. . . . . . . . . . . . . . . . . . . . . .81 9.5.3.2 Modulator Control and Status Register . . . . . . . . . . . . . .82 9.5.4 Modulator Period Data Registers . . . . . . . . . . . . . . . . . . . .85
Freescale Semiconductor, Inc...
AGREEMENT
Section 10. Phase-Locked Loop (PLL) Synthesizer
10.1 10.2 10.3 10.4 10.5 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 Phase-Locked Loop Control Register. . . . . . . . . . . . . . . . . . . .89 Operation During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . .91 Noise Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
NON-DISCLOSURE
Section 11. Instruction Set
11.1 11.2 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94
11.3 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94 11.3.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 11.3.2 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 11.3.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 11.3.4 Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 11.3.5 Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96 11.3.6 Indexed, 8-Bit Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96 11.3.7 Indexed,16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96 11.3.8 Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
General Release Specification Table of Contents For More Information On This Product, Go to: www.freescale.com MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Table of Contents
11.4 Instruction Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97 11.4.1 Register/Memory Instructions . . . . . . . . . . . . . . . . . . . . . . .98 11.4.2 Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . .99 11.4.3 Jump/Branch Instructions . . . . . . . . . . . . . . . . . . . . . . . . .100 11.4.4 Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . .102 11.4.5 Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103 11.5 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
Freescale Semiconductor, Inc...
Section 12. Electrical Specifications
12.1 12.2 12.3 12.4 12.5 12.6 12.7 12.8 12.9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 DC Electrical Characteristics (5.0 Vdc). . . . . . . . . . . . . . . . . .114 DC Electrical Characteristics (3.3 Vdc). . . . . . . . . . . . . . . . . .115 DC Electrical Characteristics (2.2 Vdc). . . . . . . . . . . . . . . . . .116 Control Timing (3.3 Vdc and 5.0 Vdc). . . . . . . . . . . . . . . . . . .117
Section 13. Mechanical Specifications
13.1 13.2 13.3 13.4 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .121 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .121 28-Pin Plastic Dual In-Line Package (Case 710-02) . . . . . . .121 28-Pin Small Outline Integrated Circuit Package (Case 751F-04). . . . . . . . . . . . . . . . . . . . . . . . . .122
MC68HC05RC17 -- Rev. 2.0 Table of Contents For More Information On This Product, Go to: www.freescale.com
General Release Specification
NON-DISCLOSURE
12.10 Control Timing (2.2 Vdc). . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
AGREEMENT
REQUIRED
Freescale Semiconductor, Inc. Table of Contents REQUIRED Section 14. Ordering Information
14.1 14.2 14.3 14.4 14.5 14.6 14.7 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123 MCU Ordering Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123 Application Program Media. . . . . . . . . . . . . . . . . . . . . . . . . . .124 ROM Program Verification . . . . . . . . . . . . . . . . . . . . . . . . . . .125 ROM Verification Units (RVUs). . . . . . . . . . . . . . . . . . . . . . . .126 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
NON-DISCLOSURE
General Release Specification Table of Contents For More Information On This Product, Go to: www.freescale.com
Freescale Semiconductor, Inc...
AGREEMENT
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
List of Figures
Figure 1-1 1-2 1-3 1-4 2-1 2-2 3-1 3-2 4-1 4-2 5-1 5-2 5-3 6-1 6-2 7-1 7-2 8-1 8-2 8-3
Title
Page
Freescale Semiconductor, Inc...
MC68HC05RC17 Memory Map . . . . . . . . . . . . . . . . . . . . . .28 I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 Programming Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Stacking Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 Interrupt Processing Flowchart. . . . . . . . . . . . . . . . . . . . . . .42 IRQ Function Block Diagram . . . . . . . . . . . . . . . . . . . . . . . .43 Reset Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Reset and POR Timing Diagram . . . . . . . . . . . . . . . . . . . . .49 COP Watchdog Timer Location . . . . . . . . . . . . . . . . . . . . . .53 Stop Recovery Timing Diagram . . . . . . . . . . . . . . . . . . . . . .56 Stop/Wait Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Port B Pullup Option. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 I/O Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 Core Timer Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . .64 Core Timer Control and Status Register (CTCSR) . . . . . . .65 Core Timer Counter Register (CTCR) . . . . . . . . . . . . . . . . .67
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General Release Specification
NON-DISCLOSURE
AGREEMENT
MC68HC05RC17 Block Diagram . . . . . . . . . . . . . . . . . . . . .17 28-Pin SOIC Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 28-Pin PDIP Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 Oscillator Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
REQUIRED
Freescale Semiconductor, Inc. List of Figures REQUIRED
Figure 9-1 9-2 9-3 9-4 9-5 9-6 9-7 9-8 10-1 10-2 12-1 12-2 12-3 12-4 Title Page
Freescale Semiconductor, Inc...
AGREEMENT
Carrier Modulator Transmitter Module Block Diagram . . . . .71 Carrier Generator Block Diagram . . . . . . . . . . . . . . . . . . . . .72 Carrier Data Register (CHR1, CLR1, CHR2, and CLR2) . . .74 Modulator Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .77 CMT Operation in Time Mode . . . . . . . . . . . . . . . . . . . . . . .78 Extended Space Operation . . . . . . . . . . . . . . . . . . . . . . . . .80 Modulator Control and Status Register (MCSR) . . . . . . . . .82 Modulator Data Registers (MDR1, MDR2, and MDR3) . . . .85 PLL Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88 Phase-Locked Loop Control Register (PLLCR) . . . . . . . . . .89 5.5-Volt Maximum Supply Current vs Internal Clock Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119 3.6-Volt Maximum Supply Current vs Internal Clock Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119 2.4-Volt Maximum Supply Current vs Internal Clock Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120 Maximum Wait Mode Supply Current vs VDD with PLL Disengaged . . . . . . . . . . . . . . . . . . . . . . . . . .120
NON-DISCLOSURE
General Release Specification
MC68HC05RC17 -- Rev. 2.0 List of Figures For More Information On This Product, Go to: www.freescale.com
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
List of Tables
Table 4-1
Title
Page
Vector Address for Interrupts and Reset . . . . . . . . . . . . . . . .40 COP Watchdog Timer Recommendations . . . . . . . . . . . . . . .52 I/O Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 RTI and COP Rates at 4.096-MHz Oscillator . . . . . . . . . . . . .66 PS1 and PS0 Speed Selects with 32.768-kHz Crystal. . . . . .90 Register/Memory Instructions. . . . . . . . . . . . . . . . . . . . . . . . .98 Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . . .99 Jump and Branch Instructions . . . . . . . . . . . . . . . . . . . . . . .101 Bit Manipulation Instructions. . . . . . . . . . . . . . . . . . . . . . . . .102 Control Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . .104 Opcode Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
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5-1 7-1 8-1 10-1 11-1 11-2 11-3 11-4 11-5 11-6 11-7 14-1
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General Release Specification
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AGREEMENT
REQUIRED
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General Release Specification List of Tables For More Information On This Product, Go to: www.freescale.com
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AGREEMENT
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
Section 1. General Description
1.1 Contents
1.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Freescale Semiconductor, Inc...
1.4
1.2 Introduction
The MC68HC05RC17 is a general-purpose, low-cost addition to the M68HC05 Family of microcontroller units (MCUs) and is suitable for remote control applications. It contains the HC05 central processing unit (CPU) core, including the 14-stage core timer with real-time interrupt (RTI) and computer operating properly (COP) watchdog systems. Onchip peripherals include a carrier modulator transmitter. The 16-Kbyte memory map has 15,936 bytes of user ROM and 352 bytes of RAM. There are 18 input-output (I/O) lines (eight having keyscan logic and pullups) and a low-power reset pin.
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General Release Specification
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1.5 Signal Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 1.5.1 VDD and VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 1.5.2 IRQ (Maskable Interrupt Request) . . . . . . . . . . . . . . . . . . .22 1.5.3 OSC1 and OSC2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22 1.5.4 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 1.5.5 LPRST. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23 1.5.6 IRO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 1.5.7 Port A (PA0-PA7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 1.5.8 Port B (PB0-PB7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24 1.5.9 Port C (PC0-PC1 and PC4-PC7). . . . . . . . . . . . . . . . . . . .24 1.5.10 XFC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 1.5.11 VDDSYN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
AGREEMENT
1.3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
REQUIRED
Freescale Semiconductor, Inc. General Description REQUIRED
The MC68HC05RC17 is available in 28-pin small outline integrated circuit (SOIC) or plastic dual in-line package (PDIP) packages. Four additional I/O lines are available for bond out in higher pin count packages.
NOTE:
Consult the factory for availability of 28-pin dual in-line and higher pin count packages.
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AGREEMENT
1.3 Features
Features of the MC68HC05RC17 include: * * * * * * * * * * Low Cost HC05 Core 28-Pin SOIC or DIP Packages On-Chip Oscillator with 32.768-kHz Crystal/Ceramic Resonator Phase-Locked Loop (PLL) Synthesizer with Programmable Speed 15,936 Bytes of User ROM 64 Bytes of Burn-In ROM 352 Bytes of On-Chip RAM 14-Stage Core Timer with Real-Time Interrupt (RTI) and Computer Operating Properly (COP) Watchdog Circuits Carrier Modulator Transmitter Supporting Baseband, Pulse Length Modulator (PLM), and Frequency Shift Keying (FSK) Protocols Low-Power Reset Pin 18 Bidirectional I/O Lines (Four Additional I/O Lines Available for Bond Out in Higher Pin Count Packages) Mask Programmable Pullups and Interrupt on Eight Port Pins (PB0-PB7) High-Current Infrared (IR) Drive Pin High-Current Port Pin (PC0)
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* * * * *
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MC68HC05RC17 -- Rev. 2.0
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General Description Features
XFC VDDSYN OSC2 OSC1 VDD VSS
PHASE LOCK LOOP IRQEN /2 INTERNAL PROCESSOR CLOCK
CARRIER MODULATOR TRANSMITTER
IRO
PC0 DATA DIRECTION REGISTER PC1 PC4* PC5* PC6* PC7*
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PORT C
COP SYSTEM
RTI SYSTEM
CORE TIMER SYSTEM
RESET LPRST CPU CONTROL M68HC05 CPU CPU REGISTERS IRQEN 0 IRQ 00 0 0 0 0 1 1 ACCUMULATOR INDEX REGISTER STACK POINTER ALU
PA0 DATA DIRECTION REGISTER PA1 PA2 PORT A PA3 PA4 PA5 PA6
PROGRAM COUNTER 11 1H I NZ C
CONDITION CODE REGISTER
PB0 SRAM -- 352 BYTES DATA DIRECTION REGISTER PB1 KEYSCAN PULLUPS PB2 PB3 PB4 PB5 PB6 PB7
ROM -- 15,936 BYTES
BURN-IN ROM -- 64 BYTES
* Marked pins are available only in higher pin count (>28) packages.
Figure 1-1. MC68HC05RC17 Block Diagram
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General Release Specification
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PA7
PORT B
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REQUIRED
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* * Power-Saving Stop and Wait Modes Mask Selectable Options: - COP Watchdog Timer - STOP Instruction Disable - Edge-Sensitive or Edge- and Level-Sensitive Interrupt Trigger - Port B Pullups for Keyscan Illegal Address Reset ROM Security
* *
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AGREEMENT
NOTE:
A line over a signal name indicates an active-low signal. For example, RESET is active low.
1.4 Mask Options
There are 11 total mask options on the MC68HC05RC17 including: * * * * Eight Port B Pullups IRQ Sensitivity COP Enable/Disable STOP Enable/Disable
NON-DISCLOSURE
These are nonprogrammable options in that they are selected at the time of code submission (when masks are made). These options are: PB7PU -- Port B7 Pullup/Interrupt This bit enables or disables the pullup/interrupt on port B, bit 7. 1 = Enables the pullup/interrupt 0 = Disables the pullup/interrupt PB6PU -- Port B6 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 6. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt
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General Description Mask Options
PB5PU -- Port B5 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 5. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt PB4PU -- Port B4 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 4. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt
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This option enables or disables the pullup/interrupt on port B, bit 3. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt PB2PU -- Port B2 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 2. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt PB1PU -- Port B1 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 1. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt PB0PU -- Port B0 Pullup/Interrupt This option enables or disables the pullup/interrupt on port B, bit 0. 1 = Enables pullup/interrupt 0 = Disables pullup/interrupt COPEN -- COP Enable When the COP option is selected (COPEN = 1), the COP watchdog timer is enabled. When the COP option is deselected (COPEN = 0), the COP watchdog timer is disabled.
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General Release Specification
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PB3PU -- Port B3 Pullup/Interrupt
REQUIRED
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STOPEN -- STOP Instruction Enable When the STOP option is selected (STOPEN = 1), the STOP instruction is enabled. When the STOP option is deselected (STOPEN = 0), the STOP instruction is equivalent to a WAIT instruction. IRQ -- IRQ sensitivity When the IRQ option is selected (IRQ = 1), edge- and level-sensitive IRQ is enabled. When the IRQ option is deselected (IRQ = 0), edge-only sensitive IRQ is enabled.
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NOTE:
The port B keyscan interrupt sensitivity will match that of the IRQ sensitivity. (See 4.7 External Interrupt (IRQ/Port B Keyscan) for more information.)
1.5 Signal Description
Pinout for the 28-pin small outline integrated circuit (SOIC) package is shown in Figure 1-2. Pinout for the 28-pin plastic dual in-line (PDIP) package is shown in Figure 1-3. The signals are described in the following subsections.
NON-DISCLOSURE
NOTE:
Consult the factory for availability of 28-pin dual in-line and higher pin count packages.
1.5.1 VDD and VSS Power is supplied to the microcontroller's digital circuits using these two pins. VDD is the positive supply and VSS is ground.
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General Description Signal Description
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PA0 PA1
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
OSC1 OSC2 VDD IRQ RESET IRO VSS LPRST XFC VDDSYN PC0 PA7 PA6
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PA3 PA4 PA5
Figure 1-2. 28-Pin SOIC Pinout
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PA0 PA1 PA2 PA3 PA4 PA5
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
OSC1 OSC2 VDD IRQ RESET
LPRST XFC VDDSYN PC1 PC0 PA7 PA6
Figure 1-3. 28-Pin PDIP Pinout
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General Release Specification
NON-DISCLOSURE
IRO VSS
AGREEMENT
PA2
PC1
REQUIRED
Freescale Semiconductor, Inc. General Description REQUIRED
1.5.2 IRQ (Maskable Interrupt Request) This pin has a mask option as specified by the user that provides one of two different choices of interrupt triggering sensitivity. The options are: 1. Negative edge-sensitive triggering only 2. Both negative edge-sensitive and level-sensitive triggering The MCU completes the current instruction before it responds to the interrupt request. When IRQ goes low for at least one tILIH, a logic 1 is latched internally to signify that an interrupt has been requested. When the MCU completes its current instruction, the interrupt latch is tested. If the interrupt latch contains a logic 1 and the interrupt mask bit (I bit) in the condition code register is clear, the MCU then begins the interrupt sequence. If the option is selected to include level-sensitive triggering, the IRQ input requires an external resistor to VDD for wired-OR operation. The IRQ pin contains an internal Schmitt trigger as part of its input to improve noise immunity. Refer to Section 4. Interrupts for more detail.
NON-DISCLOSURE
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AGREEMENT
1.5.3 OSC1 and OSC2 These pins provide control input for an on-chip clock oscillator circuit. A crystal, a ceramic resonator, or an external signal connects to these pins to provide a system clock. The oscillator frequency is two times the internal bus rate. Figure 1-4 shows the recommended circuit when using a crystal. The crystal and components should be mounted as close as possible to the input pins to minimize output distortion and startup stabilization time. A ceramic resonator may be used in place of the crystal in cost-sensitive applications. Figure 1-4 (a) shows the recommended circuit for using a ceramic resonator. The manufacturer of the particular ceramic resonator being considered should be consulted for specific information.
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General Description Signal Description
An external clock should be applied to the OSC1 input with the OSC2 pin not connected (see Figure 1-4 (b)). This setup can be used if the user does not want to run the CPU with a crystal.
NOTE:
The PLL design requires a 32.768-kHz external frequency for proper operation.
MCU
MCU
Freescale Semiconductor, Inc...
10 M
UNCONNECTED
< EXTERNAL CLOCK 30 pF 30 pF
(a) Crystal/Ceramic Resonator Oscillator Connections
(b) External Clock Source Connections
Figure 1-4. Oscillator Connections 1.5.4 RESET This active-low pin is used to reset the MCU to a known startup state by pulling RESET low. The RESET pin contains an internal Schmitt trigger as part of its input to improve noise immunity. See Section 5. Resets.
1.5.5 LPRST The LPRST pin is an active-low pin and is used to put the MCU into lowpower reset mode. In low-power reset mode the MCU is held in reset with all processor clocks halted. See Section 5. Resets.
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General Release Specification
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OSC1
OSC2
OSC1
OSC2
REQUIRED
Freescale Semiconductor, Inc. General Description REQUIRED
1.5.6 IRO The IRO pin is the high-current source and sink output of the carrier modulator transmitter subsystem which is suitable for driving infrared (IR) LED biasing logic. See Section 9. Carrier Modulator Transmitter (CMT).
1.5.7 Port A (PA0-PA7) These eight I/O lines comprise port A. The state of any pin is software programmable and all port A lines are configured as inputs during power-on or reset. For detailed information on I/O programming, see Section 7. Parallel Input/Output (I/O).
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1.5.8 Port B (PB0-PB7) These eight I/O lines comprise port B. The state of any pin is software programmable and all port B lines are configured as inputs during power-on or reset. Each port B I/O line has a mask optionable pullup for keyscan. For detailed information on I/O programming, see Section 7. Parallel Input/Output (I/O).
NON-DISCLOSURE
1.5.9 Port C (PC0-PC1 and PC4-PC7) These six I/O lines comprise port C. PC0 is a high-current pin. PC4 through PC7 are available only in higher pin count (>28) packages. The state of any pin is software programmable and all port C lines are configured as input during power-on or reset. For detailed information on I/O programming, see Section 7. Parallel Input/Output (I/O).
NOTE:
Only two bits of port C are bonded out in 28-pin packages for the MC68HC05RC17, although port C is truly a 6-bit port. Since pins PC4-PC7 are unbonded, software should include the code to set their respective data direction register locations to outputs to avoid floating inputs.
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General Description Signal Description
1.5.10 XFC This pin provides a means for connecting an external filter capacitor to the synthesizer phase-locked loop filter. (For additional information concerning this capacitor, refer to Section 10. Phase-Locked Loop (PLL) Synthesizer.)
1.5.11 VDDSYN
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NOTE:
Any unused inputs, I/O ports, and no connects should be tied to an appropriate logic level (either VDD or VSS). Although the I/O ports of the MC68HC05RC17 do not require termination, termination is recommended to reduce the possibility of static damage.
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General Release Specification
NON-DISCLOSURE
AGREEMENT
This pin provides a separate power connection to the PLL synthesizer which should be at the same potential as VDD.
REQUIRED
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General Release Specification General Description For More Information On This Product, Go to: www.freescale.com
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MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
Section 2. Memory
2.1 Contents
2.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Freescale Semiconductor, Inc...
2.2 Introduction
This section describes the organization of the on-chip memory.
2.3 Memory Map
The MC68HC05RC17 has a 16-Kbyte memory map consisting of user ROM, RAM, burn-in ROM, control registers, and input/output (I/O). Figure 2-1 is a memory map for the MC68HC05RC17. Figure 2-2 is a more detailed memory map of the I/O register section.
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General Release Specification
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2.3 Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 2.3.1 ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 2.3.2 ROM Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 2.3.3 RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
REQUIRED
Freescale Semiconductor, Inc. Memory REQUIRED
$0000 $001F $0020
I/O 32 BYTES
0000 0031 0032
PORT A DATA REGISTER PORT B DATA REGISTER PORT C DATA REGISTER RESERVED PORT A DATA DIRECTION REGISTER
$00 $01 $02 $03 $04 $05 $06 $07
RAM 160 BYTES $00BF $00C0 $00FF $0100 $017F $0180 0191 STACK 0192 64 BYTES 0255 0256 0383 0384
PORT B DATA DIRECTION REGISTER PORT C DATA DIRECTION REGISTER RESERVED
RAM 128 BYTES
CORE TIMER CONTROL & STATUS REG. $08 CORE TIMER COUNTER REGISTER RESERVED $09 $0A
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AGREEMENT
.......
$3FAF $3FB0 BURN-IN ROM & VECTORS 64 BYTES USER VECTORS 16 BYTES
16303 16304
RESERVED CMT TIMER CHR1 CMT TIMER CLR1 CMT TIMER CHR2 CMT TIMER CLR2 CMT TIMER MCSR CMT TIMER MDR1 IR TIMER MDR2 IR TIMER MDR3 RESERVED RESERVED RESERVED UNUSED UNUSED CORE TIMER VECTOR (HIGH BYTE) CORE TIMER VECTOR (LOW BYTE) CMT TIMER VECTOR (HIGH BYTE) CMT TIMER VECTOR (LOW BYTE) IRQ/PTB KEYSCAN PULLUPS VECTOR (HIGH BYTE) IRQ/PTB KEYSCAN PULLUPS VECTOR (LOW BYTE) SWI VECTOR (HIGH BYTE) SWI VECTOR (LOW BYTE) RESET VECTOR (HIGH BYTE) RESET VECTOR (LOW BYTE)
$3FEF $3FF0 $3FFF
16367 16368 16383
NON-DISCLOSURE
Figure 2-1. MC68HC05RC17 Memory Map
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MC68HC05RC17 -- Rev. 2.0
...
$3FF5 $3FF6 $3FF7 $3FF8 $3FF9 $3FFA $3FFB $3FFC $3FFD $3FFE $3FFF
..
$1E $1F $3FF0
.......
$0F $10 $11 $12 $13 $14 $15 $16 $17 $18
USER ROM 15,920 BYTES
Freescale Semiconductor, Inc.
Memory Memory Map
Addr $00 $01 $02 $03 $04 $05
Register Name Port A Data Register Port B Data Register Port C Data Register Reserved Port A Data Direction Register Port B Data Direction Register Port C Data Direction Register PLL Control Register Timer Control and Status Register Timer Counter Register Reserved Reserved Reserved Reserved Reserved Reserved CMT Timer CHR1 CMT Timer CLR1 CMT Timer CHR2 CMT Timer CLR2 CMT Timer MCSR CMT Timer MDR1 CMT Timer MDR2 CMT Timer MDR3
Bit 7 PA7 PB7 PC7 R DDRA7 DDRB7 DDRC7 0 CTOF D7 R R R R R R IROLN IROLP 0 0 EOC MB11 MB7 SB7
6 PA6 PB6 PC6 R DDRA6 DDRB6 DDRC6 BCS RTIF D6 R R R R R R CMTPOL 0 0 0 DIV2 MB10 MB6 SB6
5 PA5 PB5 PC5 R DDRA5 DDRB5 DDRC5 0 TOFE D5 R R R R R R PH5 PL5 SH5 SL5 EIMSK MB9 MB5 SB5
4 PA4 PB4 PC4 R DDRA4 DDRB4 DDRC4 BWC RTIE D4 R R R R R R PH4 PL4 SH4 SL4 EXSPC MB8 MB4 SB4
3 PA3 PB3
2 PA2 PB2
1 PA1 PB1 PC1
Bit 0 PA0 PB0 PC0 R DDRA0 DDRB0 DDRC0 PS0 RT0 D0 R R R R R R
R DDRA3 DDRB3
R DDRA2 DDRB2
R DDRA1 DDRB1 DDRC1
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$07 $08 $09 $0A $0B $0C $0D $0E $0F $10 $11 $12 $13 $14 $15 $16 $17
PLLON TOFC D3 R R R R R R PH3 PL3 SH3 SL3 BASE SB11 MB3 SB3
VCOTST RTFC D2 R R R R R R PH2 PL2 SH2 SL2 MODE SB10 MB2 SB2
PS1 RT1 D1 R R R R R R PH1 PL1 SH1 SL1 IE SB9 MB1 SB1
PL0 SH0 SL0 MCGEN SB8 MB0 SB0
= Unimplemented
R
= Reserved
Figure 2-2. I/O Registers (Sheet 1 of 2)
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General Release Specification
NON-DISCLOSURE
PH0
AGREEMENT
$06
REQUIRED
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Addr $18 $19 $1A $1B $1C $1D
Register Name Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved
Bit 7 R R R R R R R R
6 R R R R R R R R
5 R R R R R R R R
4 R R R R R R R R
3 R R R R R R R R
2 R R R R R R R R
1 R R R R R R R R
Bit 0 R R R R R R R R
Freescale Semiconductor, Inc...
AGREEMENT
$1E $1F
R
= Reserved
Figure 2-2. I/O Registers (Sheet 2 of 2) 2.3.1 ROM The user ROM consists of 15,920 bytes of ROM located from $0180 to $3FAF and 16 bytes of user vectors located from $3FF0 to $3FFF. The burn-in ROM is located from $3FB0 to $3FEF. Ten of the user vectors, $3FF6 through $3FFF, are dedicated to reset and interrupt vectors. The six remaining locations -- $3FF0, $3FF1, $3FF2, $3FF3, $3FF4, and $3FF5 -- are general-purpose user ROM locations.
NON-DISCLOSURE
2.3.2 ROM Security Security has been incorporated into the MC68HC05RC17 to prevent external viewing of the ROM contents. This feature helps ensure that customer-developed software remains proprietary.1
1. No security feature is absolutely secure. However, Motorola's strategy is to make reading or copying the ROM difficult for unauthorized users.
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Memory Memory Map
2.3.3 RAM The user RAM consists of 352 bytes of a shared stack area. The RAM starts at address $0020 and ends at address $017F. The stack begins at address $00FF. The stack pointer can access 64 bytes of RAM in the range $00FF to $00C0.
NOTE:
Using the stack area for data storage or temporary work locations requires care to prevent it from being overwritten due to stacking from an interrupt or subroutine call.
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MC68HC05RC17 -- Rev. 2.0 Memory For More Information On This Product, Go to: www.freescale.com
General Release Specification
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AGREEMENT
REQUIRED
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General Release Specification Memory For More Information On This Product, Go to: www.freescale.com
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AGREEMENT
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
Section 3. Central Processor Unit (CPU)
3.1 Contents
3.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Index Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Condition Code Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Stack Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 Program Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
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3.4 3.5 3.6 3.7 3.8
3.2 Introduction
This section describes the registers of the MC68HC05RC17's central processor unit (CPU).
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3.3
CPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
REQUIRED
Freescale Semiconductor, Inc. Central Processor Unit (CPU) REQUIRED 3.3 CPU Registers
The MCU contains five registers as shown in Figure 3-1. The interrupt stacking order is shown in Figure 3-2.
7 A 7 X 0 INDEX REGISTER 0 PC 13 0 0 0 0 0 0 7 1 1 SP CCR H I N Z C CONDITION CODE REGISTER 0 STACK POINTER PROGRAM COUNTER 0 ACCUMULATOR
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AGREEMENT
13
Figure 3-1. Programming Model
7 1 INCREASING MEMORY ADDRESSES R E T U R N 1 1 0 CONDITION CODE REGISTER ACCUMULATOR INDEX REGISTER PCH PCL UNSTACK NOTE: Since the stack pointer decrements during pushes, the PCL is stacked first, followed by PCH, etc. Pulling from the stack is in the reverse order. STACK I N T E R R U P T
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DECREASING MEMORY ADDRESSES
Figure 3-2. Stacking Order
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Central Processor Unit (CPU) Accumulator
3.4 Accumulator
The accumulator (A) is a general-purpose 8-bit register used to hold operands and results of arithmetic calculations or data manipulations.
7 A 0
3.5 Index Register
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The index register (X) is an 8-bit register used for the indexed addressing value to create an effective address. The index register may also be used as a temporary storage area.
7 X 0
3.6 Condition Code Register
The condition code register (CCR) is a 5-bit register in which the H, N, Z, and C bits are used to indicate the results of the instruction just executed, and the I bit is used to enable or disable interrupts. These bits can be individually tested by a program, and specific actions can be taken as a result of their state. Each bit is explained in the following paragraphs.
CCR H I N Z C
Half Carry (H) This bit is set during ADD and ADC operations to indicate that a carry occurred between bits 3 and 4. Interrupt (I) When this bit is set, the timer and external interrupt are masked (disabled). If an interrupt occurs while this bit is set, the interrupt is latched and processed as soon as the I bit is cleared.
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Negative (N) When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was negative. Zero (Z) When set, this bit indicates that the result of the last arithmetic, logical, or data manipulation was zero. Carry/Borrow (C) When set, this bit indicates that a carry or borrow out of the arithmetic logical unit (ALU) occurred during the last arithmetic operation. This bit is also affected during bit test and branch instructions and during shifts and rotates.
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3.7 Stack Pointer
The stack pointer (SP) contains the address of the next free location on the stack. During an MCU reset or the reset stack pointer (RSP) instruction, the stack pointer is set to location $00FF. The stack pointer is then decremented as data is pushed onto the stack and incremented as data is pulled from the stack. When accessing memory, the eight most significant bits are permanently set to 00000011. These eight bits are appended to the six least significant register bits to produce an address within the range of $00FF to $00C0. Subroutines and interrupts may use up to 64 (decimal) locations. If 64 locations are exceeded, the stack pointer wraps around and loses the previously stored information. A subroutine call occupies two locations on the stack; an interrupt uses five locations.
13 0 0 0 0 0 0 7 1 1 SP 0
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Central Processor Unit (CPU) Program Counter
3.8 Program Counter
The program counter (PC) is a 13-bit register that contains the address of the next byte to be fetched.
13 PC 0
NOTE:
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The HC05 CPU core is capable of addressing 16-bit locations. For this implementation, however, the addressing registers are limited to a 16Kbyte memory map.
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General Release Specification -- MC68HC05RC17
Section 4. Interrupts
4.1 Contents
4.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 Reset Interrupt Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Software Interrupt (SWI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41 Hardware Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 External Interrupt (IRQ/Port B Keyscan). . . . . . . . . . . . . . . . . .43 External Interrupt Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Carrier Modulator Transmitter Interrupt (CMT) . . . . . . . . . . . . .44 Core Timer Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
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4.4 4.5 4.6 4.7 4.8 4.9 4.10
The MCU can be interrupted four different ways: 1. Non-maskable software interrupt instruction (SWI) 2. External asynchronous interrupt (IRQ/port B keyscan) 3. Internal carrier modulator transmitter interrupt 4. Internal core timer interrupt
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4.2 Introduction
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4.3
CPU Interrupt Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
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Interrupts cause the processor to save register contents on the stack and to set the interrupt mask (I bit) to prevent additional interrupts. Unlike reset, hardware interrupts do not cause the current instruction execution to be halted, but are considered pending until the current instruction is complete. If interrupts are not masked (I bit in the CCR is clear) and the corresponding interrupt enable bit is set, the processor will proceed with interrupt processing. Otherwise, the next instruction is fetched and executed. If an interrupt occurs, the processor completes the current instruction, stacks the current CPU register state, sets the I bit to inhibit further interrupts, and finally checks the pending hardware interrupts. If more than one interrupt is pending following the stacking operation, the interrupt with the highest vector location shown in Table 4-1 will be serviced first. The SWI is executed the same as any other instruction, regardless of the I-bit state. When an interrupt is to be processed, the CPU fetches the address of the appropriate interrupt software service routine from the vector table at locations $3FF6 through $3FFF as defined in Table 4-1. Table 4-1. Vector Address for Interrupts and Reset
Register N/A N/A N/A MCSR CTCSR Flag Name N/A N/A N/A EOC CTOF, RTIF Reset Software Interrupt External Interrupts* End-of-Cycle Interrupt Real-Time Interrupt Core Timer Over o w Interrupt CPU Interrupt RESET SWI IRQ CMT CORE TIMER Vector Address $3FFE-$3FFF $3FFC-$3FFD $3FFA-$3FFB $3FF8-$3FF9 $3FF6-$3FF7
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*External interrupts include IRQ and port B keyscan sources.
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Interrupts Reset Interrupt Sequence
The M68HC05 CPU does not support interruptible instructions. The maximum latency to the first instruction of the interrupt service routine must include the longest instruction execution time plus stacking overhead. Latency = (Longest instruction execution time + 10) x tcyc seconds An return from interrupt (RTI) instruction is used to signify when the interrupt software service routine is completed. The RTI instruction causes the register contents to be recovered from the stack and normal processing to resume at the next instruction that was to be executed when the interrupt took place. Figure 4-1 shows the sequence of events that occurs during interrupt processing.
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4.4 Reset Interrupt Sequence
The reset function is not in the strictest sense an interrupt; however, it is acted upon in a similar manner as shown in Figure 4-1. A low-level input on the RESET pin or an internally generated RST signal causes the program to vector to its starting address, which is specified by the contents of memory locations $3FFE and $3FFF. The I bit in the condition code register is also set. The MCU is configured to a known state during this type of reset.
4.5 Software Interrupt (SWI)
The SWI is an executable instruction and a nonmaskable interrupt since it is executed regardless of the state of the I bit in the CCR. If the I bit is zero (interrupts enabled), the SWI instruction executes after interrupts that were pending before the SWI was fetched or before interrupts generated after the SWI was fetched. The interrupt service routine address is specified by the contents of memory locations $3FFC and $3FFD.
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FROM RESET
Y
I BIT IN CCR SET? N IRQ/PORT B KEYSCAN EXTERNAL INTERRUPTS? N INTERNAL CMT INTERRUPT? N INTERNAL CORE TIMER INTERRUPT? N Y Y Y EIMSK CLEAR? N Y CLEAR IRQ REQUEST LATCH.
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STACK PC, X, A, CCR. FETCH NEXT INSTRUCTION.
NON-DISCLOSURE
SET I BIT IN CC REGISTER.
SWI INSTRUCTION ? N Y RTI INSTRUCTION ? N RESTORE REGISTERS FROM STACK: CCR, A, X, PC. EXECUTE INSTRUCTION.
Y
LOAD PC FROM APPROPRIATE VECTOR.
Figure 4-1. Interrupt Processing Flowchart
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Interrupts Hardware Interrupts
4.6 Hardware Interrupts
All hardware interrupts except RESET are maskable by the I bit in the CCR. If the I bit is set, all hardware interrupts (internal and external) are disabled. Clearing the I bit enables the hardware interrupts. The three types of hardware interrupts are explained in the following sections.
4.7 External Interrupt (IRQ/Port B Keyscan)
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NOTE:
The BIH and BIL instructions will apply to the level on the IRQ pin itself and to the output of the logic OR function with the port B IRQ interrupts. The states of the individual port B pins can be checked by reading the appropriate port B pins as inputs.
The IRQ pin is one source of an external interrupt. All port B pins (PB0 through PB7) act as other external interrupt sources if the pullup/interrupt feature is enabled as speci ed b y the user.
EIMSK IRQ PIN PORT B INTERRUPT/KEYSCAN IRQ VECTOR FETCH
VDD
IRQ LATCH R
TO IRQ PROCESSING IN CPU
RST LEVEL (MASK OPTION)
Figure 4-2. IRQ Function Block Diagram
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The IRQ pin provides an asynchronous interrupt to the CPU. A block diagram of the IRQ function is shown in Figure 4-2.
REQUIRED
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When edge sensitivity is selected for the IRQ interrupt, it is sensitive to these cases: 1. Falling edge on the IRQ pin 2. Falling edge on any port B pin with pullup/interrupt enabled When edge and level sensitivity is selected for the IRQ interrupt, it is sensitive to these cases: 1. Low level on the IRQ pin
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2. Falling edge on the IRQ pin 3. Falling edge or low level on any port B pin with pullup/interrupt enabled External interrupts also can be masked by setting the EIMSK bit in the MSCR register of the IR remote timer. See 9.5.4 Modulator Period Data Registers for details.
4.8 External Interrupt Timing
If the interrupt mask bit (I bit) of the CCR is set, all maskable interrupts (internal and external) are disabled. Clearing the I bit enables interrupts. The interrupt request is latched immediately following the falling edge of the IRQ source. It is then synchronized internally and serviced as specified by the contents of $3FFA and $3FFB. Either a level-sensitive and edge-sensitive trigger or an edge-sensitiveonly trigger is available via the mask programmable option for the IRQ pin.
NON-DISCLOSURE
4.9 Carrier Modulator Transmitter Interrupt (CMT)
A CMT interrupt occurs when the end-of-cycle flag (EOC) and the endof-cycle interrupt enable (EOCIE) bits are set in the modulator control and status register (MCSR). This interrupt will vector to the interrupt service routine located at the address specified by the contents of memory locations $3FF8 and $3FF9.
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Interrupts Core Timer Interrupt
4.10 Core Timer Interrupt
This timer can create two types of interrupts. A timer overflow interrupt occurs whenever the 8-bit timer rolls over from $FF to $00 and the enable bit TOFE is set. A real-time interrupt occurs whenever the programmed time elapses and the enable bit RTIE is set. Either of these interrupts vectors to the same interrupt service routine, located at the address specified by the contents of memory locations $3FF6 and $3FF7.
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General Release Specification -- MC68HC05RC17
Section 5. Resets
5.1 Contents
5.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 Low-Power External Reset (LPRST) . . . . . . . . . . . . . . . . . . . .50
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5.4
5.5 Internal Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 5.5.1 Power-On Reset (POR). . . . . . . . . . . . . . . . . . . . . . . . . . . .50 5.5.2 Computer Operating Properly Reset (COPR) . . . . . . . . . . .51 5.5.2.1 Resetting the COP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.5.2.2 COP During Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.5.2.3 COP During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.5.2.4 COP Watchdog Timer Considerations . . . . . . . . . . . . . . .52 5.5.2.5 COP Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 5.5.3 Illegal Address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
5.2 Introduction
The MCU can be reset from five sources: two external inputs and three internal restart conditions. The RESET and LPRST pins are inputs as shown in Figure 5-1. All the internal peripheral modules will be reset by the internal reset signal (RST). Refer to Figure 5-2 for reset timing detail.
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5.3
External Reset (RESET). . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
REQUIRED
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The RESET pin is one of the two external sources of a reset. This pin is connected to a Schmitt trigger input gate to provide an upper and lower threshold voltage separated by a minimum amount of hysteresis. This external reset occurs whenever the RESET pin is pulled below the lower threshold and remains in reset until the RESET pin rises above the upper threshold. This active-low input will generate the RST signal and reset the CPU and peripherals. Termination of the external RESET input or the internal COP watchdog reset are the only reset sources that can alter the operating mode of the MCU.
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NOTE:
Activation of the RST signal is generally referred to as reset of the device, unless otherwise specified.
IRQ D LATCH RESET R CLOCKED
TO IRQ LOGIC MODE SELECT
NON-DISCLOSURE
OSC DATA ADDRESS LPRST
COP WATCHDOG (COPR) CPU S D LATCH PH2 TO OTHER PERIPHERALS
VDD
POWER-ON RESET (POR) ILLEGAL ADDRESS (ILLADDR)
RST
ADDRESS
Figure 5-1. Reset Block Diagram
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V DD > VPOR 4
0V
MC68HC05RC17 -- Rev. 2.0
t CYC 3FFE 3FFF NEW PC NEW PC 3FFE 3FFE 3FFE 3FFE 3FFF NEW PC NEW PC NEW PCH NEW PCL OP CODE PCH t RL 3 PCL OP CODE
OSC12
4064 tCYC
INTERNAL PROCESSOR CLOCK1
INTERNAL ADDRESS BUS1
INTERNAL DATA BUS1
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RESET
NOTES: 1. Internal timing signal and bus information are not available externally. 2. OSC1 line is not meant to represent frequency. It is only used to represent time. 3. The next rising edge of the internal processor clock following the rising edge of RESET initiates the reset sequence. 4. VDD must fall to a level lower than VPOR to be recognized as a power-on reset. 5. The LPRST pin resets the CPU like the RESET pin. However, 4064 POR cycles are executed first, before the reset vector address appears on the internal address bus. (See 5.3 External Reset (RESET).)
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Figure 5-2. Reset and POR Timing Diagram
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The LPRST pin is one of the two external sources of a reset. This external reset occurs whenever the LPRST pin is pulled below the lower threshold and remains in reset until the LPRST pin rises. This active-low input will, in addition to generating the RST signal and resetting the CPU and peripherals, halt all internal processor clocks. The MCU will remain in this low-power reset condition as long as a logic 0 remains on LPRST. When a logic 1 is applied to LPRST, processor clocks will be re-enabled with the MCU remaining in reset until the 4064 internal processor clock cycle (tcyc) oscillator stabilization delay is completed. If any other reset function is active at the end of this 4064-cycle delay, the RST signal remains in the reset condition until the other reset condition(s) end.
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5.5 Internal Resets
The three internally generated resets are the initial power-on reset function, the COP watchdog timer reset, and the illegal address detector. Termination of the external reset input, external LPRST input, or the internal COP watchdog timer are the only reset sources that can alter the operating mode of the MCU. The other internal resets do not have any effect on the mode of operation when their reset state ends.
NON-DISCLOSURE
5.5.1 Power-On Reset (POR) The internal POR is generated on power-up to allow the clock oscillator to stabilize. The POR is strictly for power turn-on conditions and is not able to detect a drop in the power supply voltage (brown-out). There is an oscillator stabilization delay of 4064 internal processor bus clock cycles (PH2) after the oscillator becomes active. The POR generates the RST signal that resets the CPU. If any other reset function is active at the end of this 4064-cycle delay, the RST signal remains in the reset condition until the other reset condition(s) ends.
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Resets Internal Resets
5.5.2 Computer Operating Properly Reset (COPR) The MCU contains a watchdog timer that automatically times out if not reset (cleared) within a specific time by a program reset sequence. If the COP watchdog timer is allowed to time out, an internal reset is generated to reset the MCU. Regardless of an internal or external reset, the MCU comes out of a COP reset according to the standard rules of mode selection. The COP reset function is enabled or disabled by a mask option and is verified during production testing. 5.5.2.1 Resetting the COP Writing a 0 to the COPF bit prevents a COP reset. This action resets the counter and begins the time out period again. The COPF bit is bit 0 of address $3FF0. A read of address $3FF0 returns user data programmed at that location. 5.5.2.2 COP During Wait Mode The COP continues to operate normally during wait mode. The software should pull the device out of wait mode periodically and reset the COP by writing to the COPF bit to prevent a COP reset. 5.5.2.3 COP During Stop Mode When the stop enable mask option is selected, stop mode disables the oscillator circuit and thereby turns the clock off for the entire device. When stop is executed, the COP counter will hold its current state. If a reset is used to exit stop mode, the COP counter is reset and held until 4064 POR cycles are completed at which time counting will begin. If an external IRQ is used to exit stop mode, the COP counter does not wait for the completion of the 4064 POR cycles but does count these cycles. Therefore, it is recommended that the COP is fed before executing the STOP instruction.
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5.5.2.4 COP Watchdog Timer Considerations The COP watchdog timer is active in all modes of operation if enabled by a mask option. If the COP watchdog timer is selected by a mask option, any execution of the STOP instruction (either intentionally or inadvertently due to the CPU being disturbed) causes the oscillator to halt and prevents the COP watchdog timer from timing out. If the COP watchdog timer is selected by a mask option, the COP resets the MCU when it times out. Therefore, it is recommended that the COP watchdog be disabled for a system that must have intentional uses of the wait mode for periods longer than the COP time out period. The recommended interactions and considerations for the COP watchdog timer, STOP instruction, and WAIT instruction are summarized in Table 5-1. Table 5-1. COP Watchdog Timer Recommendations
IF the Following Conditions Exist: Wait Time
Wait Time Less than COP Time Out Wait Time More than COP Time Out Any Length Wait Time
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THEN the COP Watchdog Timer Should Be:
Enable or Disable COP by Mask Option Disable COP by Mask Option Disable COP by Mask Option
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General Release Specification
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Resets Internal Resets
5.5.2.5 COP Register The COP register is shared with the LSB of an unimplemented user interrupt vector as shown in Figure 5-3. Reading this location returns whatever user data has been programmed at this location. Writing a 0 to the COPR bit in this location clears the COP watchdog timer.
Address: $3FF0 Bit 7 6 X 5 X 4 X 3 X 2 X 1 X Bit 0
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Write: Reset: -- -- -- -- -- -- --
COPR 0
= Unimplemented
Figure 5-3. COP Watchdog Timer Location
5.5.3 Illegal Address An illegal address reset is generated when the CPU attempts to fetch an instruction from I/O address space ($0000 to $001F).
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Read:
X
X
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General Release Specification -- MC68HC05RC17
Section 6. Low-Power Modes
6.1 Contents
6.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Wait Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56 Low-Power Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
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6.4 6.5
6.2 Introduction
This section describes the low-power modes.
6.3 Stop Mode
The STOP instruction places the MCU in its lowest power-consumption mode. In stop mode, the internal oscillator is turned off, halting all internal processing, including timer operation. During the stop mode, the CTCSR ($08) bits are altered to remove any pending timer interrupt request and to disable any further timer interrupts. The timer prescaler is cleared. The I bit in the CCR is cleared to enable external interrupts. All other registers and memory remain unaltered. All input/output lines remain unchanged. The processor can be brought out of stop mode only by an external interrupt or RESET. Refer to Figure 6-1.
NOTE:
If an external interrupt is pending when stop mode is entered, then stop mode will be exited immediately.
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6.3
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
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OSC11 tRL RESET
IRQ2
tLIH
IRQ3
tILCH
4064 tCYC
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INTERNAL CLOCK INTERNAL ADDRESS BUS
3FFE
3FFE
3FFE
3FFE
3FFF
NOTES: 1. Represents the internal gating of the OSC1 pin 2. IRQ pin edge-sensitive mask option 3. IRQ pin level and edge-sensitive mask option
RESET OR INTERRUPT VECTOR FETCH
Figure 6-1. Stop Recovery Timing Diagram
NOTE:
NON-DISCLOSURE
The EIMSK bit of the carrier modulator transmitter MCSR (modulator control and status register) is not cleared automatically by the execution of a STOP instruction. Care should be taken to clear this bit before entering stop mode.
6.4 Wait Mode
The WAIT instruction places the MCU in a low power-consumption mode, but wait mode consumes more power than stop mode. All CPU action is suspended, but the core timer, the oscillator, and any enabled module remain active. Any interrupt or reset will cause the MCU to exit wait mode. The user must shut off subsystems to reduce power consumption. Wait current specifications assume CPU operation only and do not include current consumption by any other subsystems.
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Low-Power Modes Wait Mode
During wait mode, the I bit in the CCR is cleared to enable interrupts. All other registers, memory, and input/output lines remain in their previous states. The timer may be enabled to allow a periodic exit from wait mode.
NOTE:
For minimum current consumption, the phase-locked loop (PLL) should be disabled or turned off before entering wait mode.
STOP
WAIT
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STOP OSCILLATOR AND ALL CLOCKS. CLEAR I BIT.
OSCILLATOR ACTIVE. IR TIMER CLOCK ACTIVE. CORE TIMER CLOCK ACTIVE. PROCESSOR CLOCKS STOPPED.
N
LPRST OR RESET? Y
LPRST OR RESET? Y
N
N
EXTERNAL INTERRUPT (PTB KEYSCAN PULLUPS) (IRQ)? Y
EXTERNAL INTERRUPT N (PTB KEYSCAN PULLUPS) (IRQ)? Y IR TIMER INTERNAL Y INTERRUPT? Y
TURN ON OSCILLATOR. WAIT FOR TIME DELAY TO STABILIZE.
RESTART PROCESSOR CLOCK.
CORE TIMER INTERNAL INTERRUPT? Y
N
1. FETCH RESET VECTOR OR 2. SERVICE INTERRUPT A. STACK B. SET I BIT C. VECTOR TO INTERRUPT ROUTINE
1. FETCH RESET VECTOR OR 2. SERVICE INTERRUPT A. STACK B. SET I BIT C. VECTOR TO INTERRUPT ROUTINE
Figure 6-2. Stop/Wait Flowchart
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General Release Specification
NON-DISCLOSURE
N
AGREEMENT
REQUIRED
Freescale Semiconductor, Inc. Low-Power Modes REQUIRED 6.5 Low-Power Reset
Low-power reset mode is entered when a logic 0 is detected on the LPRST pin. When in this mode (as long as LPRST is held low), the MCU is held in reset and all internal clocks are halted. Applying a logic 1 to LPRST will cause the part to exit low-power reset mode and begin counting out the 4064-cycle oscillator stabilization period. Once this time has elapsed, the MCU will begin operation from the reset vectors ($3FFE-$3FFF).
NON-DISCLOSURE
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Freescale Semiconductor, Inc...
AGREEMENT
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
Section 7. Parallel Input/Output (I/O)
7.1 Contents
7.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60 Port C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 Input/Output (I/O) Programming . . . . . . . . . . . . . . . . . . . . . . . .61
Freescale Semiconductor, Inc...
7.4 7.5 7.6
7.2 Introduction
In user mode, 18 lines are arranged as one 2-bit and two 8-bit I/O ports. These ports are programmable as either inputs or outputs under software control of the data direction registers.
Four extra I/O ports are available on higher pin count packages. Consult factory for availability.
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General Release Specification
NON-DISCLOSURE
NOTE:
To avoid a glitch on the output pins, write data to the I/O port data register before writing a 1 to the corresponding data direction register.
AGREEMENT
7.3
Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
REQUIRED
Freescale Semiconductor, Inc. Parallel Input/Output (I/O) REQUIRED 7.3 Port A
Port A is an 8-bit bidirectional port which does not share any of its pins with other subsystems. The port A data register is at $0000 and the data direction register (DDR) is at $0004. Reset does not affect the data register, but clears the data direction register, thereby returning the ports to inputs. Writing a 1 to a DDR bit sets the corresponding port bit to output mode.
Freescale Semiconductor, Inc...
AGREEMENT
7.4 Port B
Port B is an 8-bit bidirectional port which does not share any of its pins with other subsystems. The address of the port B data register is $0001 and the data direction register (DDR) is at address $0005. Reset does not affect the data register, but clears the data direction register, thereby returning the ports to inputs. Writing a 1 to a DDR bit sets the corresponding port bit to output mode. Each of the port B pins has a mask programmable pullup device that can be enabled. When the pullup device is enabled, this pin will also become an interrupt pin. The edge or edge and level sensitivity of the IRQ pin will also pertain to the enabled port B pins. Care needs to be taken when using port B pins that have the pullup enabled. Before switching from an output to an input, the data should be preconditioned to a logic 1 or the I bit should be set in the condition code register to prevent an interrupt from occurring.
NON-DISCLOSURE
NOTE:
When a port B pin is configured as an output, its corresponding keyscan interrupt is disabled, regardless of its mask option.
VDD
VDD DISABLED
MASK OPTION (PB7PU) DDR BIT ENABLED
PB7 NORMAL PORT CIRCUITRY AS SHOWN IN FIGURE 7-2 IRQEN IRQ TO INTERRUPT LOGIC
FROM ALL OTHER PORT B PINS
Figure 7-1. Port B Pullup Option
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Freescale Semiconductor, Inc.
Parallel Input/Output (I/O) Port C
7.5 Port C
Port C is a 6-bit bidirectional port (PC0-PC1 and PC4-PC7) which does not share any of its pins with other subsystems. The port C data register is at $0002 and the data direction register (DDR) is at $0006. Reset does not affect the data register, but clears the data direction register, thereby returning the ports to inputs. Writing a 1 to a DDR bit sets the corresponding port bit to output mode. Port C pins PC4 through PC7 are available only in higher pin count (>28 pin) packages.
Freescale Semiconductor, Inc...
7.6 Input/Output (I/O) Programming
Port pins may be programmed as inputs or outputs under software control. The direction of the pins is determined by the state of the corresponding bit in the port data direction register (DDR). Each I/O port has an associated DDR. Any I/O port pin is configured as an output if its corresponding DDR bit is set to a logic 1. A pin is configured as an input if its corresponding DDR bit is cleared to a logic 0. At power-on or reset, all DDRs are cleared, which configures all pins as inputs. The data direction registers are capable of being written to or read by the processor. During the programmed output state, a read of the data register actually reads the value of the output data latch and not the I/O pin.
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General Release Specification
NON-DISCLOSURE
AGREEMENT
NOTE:
Only two bits of port C are bonded out in 28-pin packages for the MC68HC05RC17, although port C is truly a 6-bit port. Since pins PC4-PC7 are unbonded, software should include the code to set their respective data direction register locations to outputs to avoid floating inputs.
REQUIRED
Freescale Semiconductor, Inc. Parallel Input/Output (I/O) REQUIRED
Table 7-1. I/O Pin Functions
R/W 0 0 1 1 DDR 0 1 0 1 I/O Pin Functions The I/O pin is in input mode. Data is written into the output data latch. Data is written into the output data latch and output to the I/O pin. The state of the I/O pin is read. The I/O pin is in an output mode. The output data latch is read.
Freescale Semiconductor, Inc...
AGREEMENT
DATA DIRECTION REGISTER BIT
INTERNAL HC05 CONNECTIONS
LATCHED OUTPUT DATA BIT
OUTPUT
I/O PIN
INPUT REG BIT
NON-DISCLOSURE
INPUT I/O
Figure 7-2. I/O Circuitry
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MC68HC05RC17 -- Rev. 2.0
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General Release Specification -- MC68HC05RC17
Section 8. Core Timer
8.1 Contents
8.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63 Core Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . .67 Computer Operating Properly (COP) Reset . . . . . . . . . . . . . . .67 Timer During Wait Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
Freescale Semiconductor, Inc...
8.4 8.5 8.6
8.2 Introduction
The core timer for this device is a 14-stage multifunctional ripple counter. Features include timer overflow, power-on reset (POR), real-time interrupt (RTI), and COP watchdog timer. As seen in Figure 8-1, the internal peripheral clock is divided by four, and then drives an 8-bit ripple counter. The value of this 8-bit ripple counter can be read by the CPU at any time by accessing the core timer counter register (CTCR) at address $09. A timer overflow function is implemented on the last stage of this counter, giving a possible interrupt rate of the internal peripheral clock(E)/1024. This point is then followed by three more stages, with the resulting clock (E/4096) driving the realtime interrupt circuit (RTI). The RTI circuit consists of three divider stages with a one-of-four selector. The output of the RTI circuit is further divided by eight to drive the mask optional COP watchdog timer circuit. The RTI rate selector bits and the RTI and CTOF enable bits and flags are located in the timer control and status register at location $08.
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General Release Specification
NON-DISCLOSURE
AGREEMENT
8.3
Core Timer Control and Status Register. . . . . . . . . . . . . . . . . .65
REQUIRED
Freescale Semiconductor, Inc. Core Timer REQUIRED
INTERNAL BUS COP CLEAR
8
8 CTCR $09 CORE TIMER COUNTER REGISTER (CTCR)
INTERNAL PERIPHERAL CLOCK (E) E / 22
E / 210
/4
E / 212
POR
Freescale Semiconductor, Inc...
AGREEMENT
5-BIT COUNTER
E / 215 E / 214 E / 213 E / 212
TCBP
RTI SELECT CIRCUIT
OVERFLOW DETECT CIRCUIT RTIOUT CTCSR CTOF RTIF TOFE RTIE TOFC RTFC RT1 RT0 TIMER CONTROL & $08 STATUS REGISTER
NON-DISCLOSURE
INTERRUPT CIRCUIT
COP WATCHDOG TIMER (/8) 23
TO INTERRUPT LOGIC
TO RESET LOGIC
Figure 8-1. Core Timer Block Diagram
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Core Timer Core Timer Control and Status Register
8.3 Core Timer Control and Status Register
The CTCSR contains the timer interrupt flag, the timer interrupt enable bits, and the real-time interrupt rate select bits. Figure 8-2 shows the value of each bit in the CTCSR when coming out of reset.
Address: $0008 Bit 7 Read: CTOF 6 RTIF TOFE Write: Reset: 0 0 0 0 RTIE TOFC 0 RTFC 0 1 1 5 4 3 0 2 0 1 RT1 Bit 0 RT0
Freescale Semiconductor, Inc...
= Unimplemented
Figure 8-2. Core Timer Control and Status Register (CTCSR) CTOF -- Core Timer Overflow CTOF is a read-only status bit set when the 8-bit ripple counter rolls over from $FF to $00. Clearing the CTOF is done by writing a 1 to TOFC. Writing to this bit has no effect. Reset clears CTOF. RTIF -- Real-Time Interrupt Flag of-four selector. The clock frequency that drives the RTI circuit is E/212 (or E / 4096) with three additional divider stages, giving a maximum interrupt period of 16 milliseconds at a bus rate of 2.024 MHz. RTIF is a clearable, read-only status bit and is set when the output of the chosen (one-of-four selection) stage goes active. Clearing the RTIF is done by writing a 1 to RTFC. Writing has no effect on this bit. Reset clears RTIF. TOFE -- Timer Overflow Enable When this bit is set, a CPU interrupt request is generated when the CTOF bit is set. Reset clears this bit. RTIE -- Real-Time Interrupt Enable When this bit is set, a CPU interrupt request is generated when the RTIF bit is set. Reset clears this bit.
MC68HC05RC17 -- Rev. 2.0 Core Timer For More Information On This Product, Go to: www.freescale.com General Release Specification
NON-DISCLOSURE
The real-time interrupt circuit consists of a 3-stage divider and a one-
AGREEMENT
REQUIRED
Freescale Semiconductor, Inc. Core Timer REQUIRED
TOFC -- Timer Overflow Flag Clear When a 1 is written to this bit, CTOF is cleared. Writing a 0 has no effect on the CTOF bit. This bit always reads as 0. RTFC -- Real-Time Interrupt Flag Clear When a 1 is written to this bit, RTIF is cleared. Writing a 0 has no effect on the RTIF bit. This bit always reads as 0. RT1 and RT0 -- Real-Time Interrupt Rate Select These two bits select one of four taps from the real-time interrupt circuit. Refer to Table 8-1. Reset sets these two bits which selects the lowest periodic rate and gives the maximum time in which to alter these bits if necessary. Care should be taken when altering RT0 and RT1 if the time out period is imminent or uncertain. If the selected tap is modified during a cycle in which the counter is switching, an RTIF could be missed or an additional one could be generated. To avoid problems, the COP should be cleared before changing RTI taps. Table 8-1. RTI and COP Rates at 4.096-MHz Oscillator
RTI Rate 2.048-MHz Bus 2 ms 4 ms 8 ms 16 ms 212 / E 213 / E 214 / E 215 / E RT1 and RT0 00 01 10 11 Minimum COP Rates 2.048-MHz Bus (215-212)/E (216-213)/E (217-214)/E (218-215)/E 14 ms 28 ms 56 ms 112 ms
NON-DISCLOSURE
General Release Specification
Freescale Semiconductor, Inc...
AGREEMENT
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Freescale Semiconductor, Inc.
Core Timer Core Timer Counter Register
8.4 Core Timer Counter Register
The timer counter register is a read-only register that contains the current value of the 8-bit ripple counter at the beginning of the timer chain. This counter is clocked by the CPU clock (E/4) and can be used for various functions, including a software input capture. Extended time periods can be attained using the TOF function to increment a temporary RAM storage location, thereby simulating a 16-bit (or more) counter.
Address: $0009 Bit 7 Read: Write: Reset: 0 0 0 0 0 0 0 0 D7 6 D6 5 D5 4 D4 3 D3 2 D2 1 D1 Bit 0 D0
Freescale Semiconductor, Inc...
= Unimplemented
Figure 8-3. Core Timer Counter Register (CTCR) The power-on cycle clears the entire counter chain and begins clocking the counter. After 4064 cycles, the power-on reset circuit is released, which again clears the counter chain and allows the device to come out of reset. At this point, if RESET is not asserted, the timer starts counting up from zero and normal device operation begins. When RESET is asserted any time during operation (other than POR and low-power reset), the counter chain is cleared.
8.5 Computer Operating Properly (COP) Reset
The COP watchdog timer function is implemented on this device by using the output of the RTI circuit and further dividing it by eight. The minimum COP reset rates are listed in Table 8-1. If the COP circuit times out, an internal reset is generated and the normal reset vector is fetched. Preventing a COP time out or clearing the COP is accomplished by writing a 0 to bit 0 of address $3FF0. When the COP is cleared, only the final divide-by-eight stage (output of the RTI) is cleared.
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General Release Specification
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REQUIRED
Freescale Semiconductor, Inc. Core Timer REQUIRED
If the COP watchdog timer is allowed to time out, an internal reset is generated to reset the MCU. The COP remains enabled after execution of the WAIT instruction and all associated operations apply. If the STOP instruction is disabled, execution of STOP instruction causes the CPU to execute a no operation (NOP) instruction. In addition, the COP is prohibited from being held in reset. This prevents a device lock-up condition. This COP's objective is to make it impossible for this device to become stuck or locked-up and to be sure the COP is able to rescue the part from any situation where it might entrap itself in abnormal or unintended behavior. This function is a mask option.
Freescale Semiconductor, Inc...
AGREEMENT
8.6 Timer During Wait Mode
The CPU clock halts during wait mode, but the timer remains active. If interrupts are enabled, a timer interrupt will cause the processor to exit wait mode. The COP is always enabled while in user mode.
NON-DISCLOSURE
General Release Specification Core Timer For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
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General Release Specification -- MC68HC05RC17
Section 9. Carrier Modulator Transmitter (CMT)
9.1 Contents
9.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
Freescale Semiconductor, Inc...
9.4 Carrier Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72 9.4.1 Time Counter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 9.4.2 Carrier Generator Data Registers . . . . . . . . . . . . . . . . . . . .74 9.5 Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76 9.5.1 Time Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77 9.5.2 FSK Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79 9.5.3 Extended Space Operation . . . . . . . . . . . . . . . . . . . . . . . . .80 9.5.3.1 End-of-Cycle (EOC) Interrupt. . . . . . . . . . . . . . . . . . . . . .81 9.5.3.2 Modulator Control and Status Register . . . . . . . . . . . . . .82 9.5.4 Modulator Period Data Registers . . . . . . . . . . . . . . . . . . . .85
9.2 Introduction
The carrier modulator transmitter (CMT) module provides a means to generate the protocol timing and carrier signals for a wide variety of encoding schemes. It incorporates hardware to off-load the critical and/or lengthy timing requirements associated with code generation from the CPU, releasing much of its bandwidth to handle other tasks such as code data generation, data decompression, or keyboard scanning. The CMT does not include dedicated hardware configurations for specific protocols but is intended to be sufficiently programmable in its function to handle the timing requirements of most protocols with
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General Release Specification
NON-DISCLOSURE
AGREEMENT
9.3
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
REQUIRED
Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT) REQUIRED
minimal CPU intervention. When disabled, certain CMT registers can be used to change the state of the infrared out pin (IRO) directly. This feature allows for the generation of future protocols not readily producible by the current architecture.
9.3 Overview
The module consists of carrier generator, modulator, and transmitter output blocks. The block diagram is shown in Figure 9-1. The carrier generator has a resolution of 500 ns with a 2-MHz oscillator. The user may independently define the high and low times of the carrier signal to determine both period and duty cycle. The carrier generator can generate signals with periods between 1 s (1 MHz) and 64 s (15.6 kHz) in steps of 500 ns. The possible duty cycle options will depend upon the number of counts required to complete the carrier period. For example, a 400-kHz signal has a period of 2.5 s and will therefore require 5 x 500 ns counts to generate. These counts may be split between high and low times so the duty cycles available will be 20% (one high, four low), 40% (two high, three low), 60% (three high, two low) and 80% (four high, one low). For lower frequency signals with larger periods, higher resolution (as a percentage of the total period) duty cycles are possible. The carrier generator may select between two sets of high and low times. When operating in normal mode (subsequently referred to as time mode), just one set will be used. When operating in FSK (frequency shift key) mode, the generator will toggle between the two sets when instructed to do so by the modulator, allowing the user to dynamically switch between two carrier frequencies without CPU intervention. When the BASE bit in the modulator control and status register (MCSR) is set, the carrier output to the modulator is held high continuously to allow for the generation of baseband protocols. See 9.4 Carrier Generator. The modulator provides a simple method to control protocol timing. The modulator has a resolution of 4 s with a 2-MHz oscillator. It can count system clocks to provide real-time control or it can count carrier clocks for self-clocked protocols. It can either gate the carrier onto the
NON-DISCLOSURE
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AGREEMENT
General Release Specification Carrier Modulator Transmitter (CMT) For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Carrier Modulator Transmitter (CMT) Overview
PRIMARY/SECONDARY SELECT MODE BASE
fOSC
.
CARRIER GENERATOR
CARRIER OUT
MODULATOR OUT MODULATOR
TRANSMITTER OUTPUT
IRO PIN
Freescale Semiconductor, Inc...
EOC INTERRUPT ENABLE
EOC FLAG
MODULATOR/ CARRIER ENABLE
fOSC / 2
CPU INTERFACE
DB
AB
EOC INTERRUPT
Figure 9-1. Carrier Modulator Transmitter Module Block Diagram modulator output (TIME), control the logic level of the modulator output (baseband) or directly route the carrier to the modulator output while providing a signal to switch the carrier generator between high/low time register buffers (FSK). See 9.5 Modulator. The transmitter output block controls the state of the infrared out pin (IRO). The modulator output is gated on to the IRO pin when the modulator/carrier generator is enabled. Otherwise, the IRO pin is controlled by the state of the IRO latch, which is directly accessible to the CPU by means of bit 7 of the carrier generator data registers CHR1 and CLR1. The IRO latch can be written to on either edge of the internal bus clock (fosc/2), allowing for IR waveforms which have a resolution of twice the bus clock frequency (fosc). See 9.4.2 Carrier Generator Data Registers.
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General Release Specification
NON-DISCLOSURE
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REQUIRED
Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT) REQUIRED 9.4 Carrier Generator
The carrier signal is generated by counting a predetermined number of input clocks (500 ns for a 2-MHz oscillator) for both the carrier high time and the carrier low time. The period is determined by the total number of clocks counted. The duty cycle is determined by the ratio of high time clocks to total clocks counted. The high and low time values are user programmable and are held in two registers. An alternate set of high/low count values is held in another set of registers to allow the generation of dual frequency FSK (frequency shift keying) protocols without CPU intervention. The MCGEN bit in the MCSR must be set and the BASE bit in the MCSR must be cleared to enable carrier generator clocks. The block diagram is shown in Figure 9-2.
Freescale Semiconductor, Inc...
AGREEMENT
SECONDARY HIGH COUNT REGISTER PRIMARY HIGH COUNT REGISTER
COUNT REGISTER SELECT CONTROL
=? fOSC CLOCK AND OUTPUT CONTROL
MODE
NON-DISCLOSURE
BASE MODULATOR/ CARRIER GENERATOR ENABLE
CLK CLR
6-BIT UP COUNTER
PRIMARY/ SECONDARY SELECT
CARRIER OUT
=?
SECONDARY LOW COUNT REGISTER PRIMARY LOW COUNT REGISTER
Figure 9-2. Carrier Generator Block Diagram
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Carrier Modulator Transmitter (CMT) Carrier Generator
9.4.1 Time Counter The high/low time counter is a 6-bit up counter. After each increment, the contents of the counter are compared with the appropriate high or low count value register. When this value is reached, the counter is reset and the compare is redirected to the other count value register. Assuming that the high time count compare register is currently active, a valid compare will cause the carrier output to be driven low. The counter will continue to increment and when reaching the value stored in the selected low count value register, it will be cleared and will cause the carrier output to be driven high. The cycle repeats, automatically generating a periodic signal which is directed to the modulator. The lowest frequency (maximum period) and highest frequency (minimum period) which can be generated are. fmin = fosc / (2 x (26 - 1)) Hz fmax = fosc / (2 x 1) Hz In the general case, the carrier generator output frequency is: fout = fosc / (Highcount + Lowcount) Hz Where: 0 < Highcount < 64 and 0 < Lowcount < 64
Freescale Semiconductor, Inc...
NOTE:
These equations assume the DIV2 bit (bit 6) of the MCSR is clear. When the DIV2 bit is set, the carrier generator frequency will be half of what is shown in these equations.
The duty cycle of the carrier signal is controlled by varying the ratio of high time to low + high time. As the input clock period is fixed, the duty cycle resolution will be proportional to the number of counts required to generate the desired carrier period.
Highcount Duty Cycle = --------------------------------------------------------------Highcount + Lowcount
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REQUIRED
Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT) REQUIRED
9.4.2 Carrier Generator Data Registers The carrier generator contains two, 7-bit data registers: primary high time (CHR1), primary low time (CLR1); and two, 6-bit data registers: secondary high time (CHR2) and secondary low time (CLR2). Bit 7 of CHR1 and CHR2 is used to read and write the IRO latch.
CHR1 Address: $0010 Bit 7 6 CMTPOL 0 5 PH5 U 4 PH4 U 3 PH3 U 2 PH2 U 1 PH1 U Bit 0 PH0 U
Freescale Semiconductor, Inc...
AGREEMENT
Read: IROLN Write: Reset: 0 U = Unaffected CLR1 Address: $0011 Bit 7 Read: IROLP Write: Reset: 0 U = Unaffected CHR2 Address: $0012 Bit 7 Read: 0 Write: Reset: 0 U = Unaffected CLR2 Address: $0013 Bit 7 Read: 0 Write: Reset: 0 U = Unaffected 0 U U U U U U 0 SL5 SL4 SL3 SL2 SL1 SL0 6 5 4 3 2 1 Bit 0 0 U U U U U U 0 SH5 SH4 SH3 SH2 SH1 SH0 6 5 4 3 2 1 Bit 0 0 U U U U U U 0 PL5 PL4 PL3 PL2 PL1 PL0 6 5 4 3 2 1 Bit 0
NON-DISCLOSURE
Figure 9-3. Carrier Data Register (CHR1, CLR1, CHR2, and CLR2)
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Freescale Semiconductor, Inc.
Carrier Modulator Transmitter (CMT) Carrier Generator
PH0-PH5 and PL0-PL5 -- Primary Carrier High and Low Time Data Values When selected, these bits contain the number of input clocks required to generate the carrier high and low time periods. When operating in time mode (see 9.5.1 Time Mode), this register pair is always selected. When operating in FSK mode (see 9.5.2 FSK Mode), this register pair and the secondary register pair are alternately selected under control of the modulator. The primary carrier high and low time values are undefined out of reset. These bits must be written to nonzero values before the carrier generator is enabled to avoid spurious results.
Freescale Semiconductor, Inc...
NOTE:
Writing to CHR1 to update PH0-PH5 or to CLR1 to update PL0-PL5 will also update the IRO latch. When MCGEN (bit 0 in the MCSR) is clear, the IRO latch value appears on the IRO output pin. Care should be taken that bit 7 of the data to be written to CHR1 or CHL1 should contain the desired state of the IRO latch.
SH0-SH5 and SL0-SL5 -- Secondary Carrier High and Low Time Data Values When selected, these bits contain the number of input clocks required to generate the carrier high and low time periods. When operating in time mode (see 9.5.1 Time Mode), this register pair is never selected. When operating in FSK mode (see 9.5.2 FSK Mode), this register pair and the secondary register pair are alternately selected under control of the modulator. The secondary carrier high and low time values are undefined out of reset. These bits must be written to nonzero values before the carrier generator is enabled when operating in FSK mode. IROLN and IROLP -- IRO Latch Control Reading IROLN or IROLP reads the state of the IRO latch. Writing IROLN updates the IRO latch with the data being written on the negative edge of the internal processor clock (fosc/2). Writing IROLP updates the IRO latch on the positive edge of the internal processor clock; for example, one fosc period later. The IRO latch is clear out of reset.
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NON-DISCLOSURE
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REQUIRED
Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT) REQUIRED
NOTE:
Writing to CHR1 to update IROLN or to CLR1 to update IROLP will also update the primary carrier high and low data values. Care should be taken that bits 5-0 of the data to be written to CHR1 or CHL1 should contain the desired values for the primary carrier high or low data.
9.5 Modulator
The modulator consists of a 12-bit down counter with underflow detection which is loaded from the modulation mark period from the mark buffer register, MBUFF. When this counter underflows, the modulator gate is closed and a 12-bit comparator is enabled which continually compares the logical complement of the contents of the (still) decrementing counter with the contents of the modulation space period register, SREG. When a match is obtained, the modulator control gate is opened again. Should SREG = 0, the match will be immediate and no space period will be generated (for instance, for FSK protocols which require successive bursts of different frequencies). When the match occurs, the counter is reloaded with the contents of MBUFF, SREG is reloaded with the contents of its buffer, SBUFF, and the cycle repeats. The MCGEN bit in the MCSR must be set to enable the modulator timer. The 12-bit MBUFF and SBUFF registers are accessed through three 8bit modulator period registers, MDR1, MDR2, and MDR3. The modulator can operate in two modes, time or FSK. In time mode the modulator counts clocks derived from the system oscillator and modulates a single-carrier frequency or no carrier (baseband). In FSK mode, the modulator counts carrier periods and instructs the carrier generator to alternate between two carrier frequencies whenever a modulation period (mark + space counts) expires.
NON-DISCLOSURE
Freescale Semiconductor, Inc...
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General Release Specification Carrier Modulator Transmitter (CMT) For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Carrier Modulator Transmitter (CMT) Modulator
12 BITS 0 MBUFF /8 CLOCK CONTROL 13-BIT DOWN COUNTER * COUNTER 12 LOAD MBUFF/SBUFF . =? MODULATOR GATE MODULATOR OUT . CARRIER OUT fOSC
SYSTEM CONTROL PRIMARY/SECONDARY SELECT
Freescale Semiconductor, Inc...
SREG *
EXTENDED SPACE
EOC FLAG SET
12
MODULATOR/ CARRIER GENERATOR ENABLE EOC FLAG
SBUFF 12 BITS MODULATOR CONTROL/STATUS REGISTER
EOC INTERRUPT ENABLE MODE BASE
* DENOTES HIDDEN REGISTER
DIV2
Figure 9-4. Modulator Block Diagram
9.5.1 Time Mode When the modulator operates in time mode, the modulation mark and space periods consist of zero or an integer number of fosc / 8 clocks (= 250 kHz @ 2 MHz osc). This provides a modulator resolution of 4 s and a maximum mark and space periods of about 16 ms (each). However, to prevent carrier glitches which could affect carrier spectral purity, the modulator control gate and carrier clock are synchronized. The carrier signal is activated when the modulator gate opens. The modulator gate can only close when the carrier signal is low. (The output logic level during space periods is low). If the carrier generator is in baseband mode (BASE bit in MCSR is high), the modulator output will be at a logic 1 for the duration of the mark period and at a logic 0 for the duration of a space period. See Figure 9-5.
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MS BIT
Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT) REQUIRED
The mark and space time equations are: ( MBUFF + 1 ) x 8 t mark = --------------------------------------------- sec s f osc
SBUFF x 8 t space = ----------------------------- sec s f osc Setting the DIV2 bit in the MCSR will double mark and space times.
Freescale Semiconductor, Inc...
AGREEMENT
fOSC / 8
CARRIER FREQUENCY
MODULATOR GATE
MARK
SPACE
MARK
SPACE
MARK
NON-DISCLOSURE
TIME MODE OUTPUT
BASEBAND OUTPUT
Figure 9-5. CMT Operation in Time Mode
General Release Specification Carrier Modulator Transmitter (CMT) For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Carrier Modulator Transmitter (CMT) Modulator
9.5.2 FSK Mode When the modulator operates in FSK mode, the modulation mark and space periods consist of an integer number of carrier clocks (space period can be zero). When the mark period expires, the space period is transparently started (as in time mode); however, in FSK mode the carrier switches between data registers in preparation for the next mark period. The carrier generator toggles between primary and secondary data register values whenever the modulator mark period expires. The space period provides an interpulse gap (no carrier), but if SBUFF = 0, then the modulator and carrier generator will switch between carrier frequencies without a gap or any carrier glitches (zero space). Using timing data for carrier burst and interpulse gap length calculated by the CPU, FSK mode automatically can generate a phase-coherent, dual-frequency FSK signal with programmable burst and interburst gaps. The mark and space time equations for FSK mode are: MBUFF + 1 t mark = ------------------------------- sec s f cg SBUFF t space = -------------------- sec s f cg Where fcg is the frequency output from the carrier generator, setting the DIV2 bit in the MCSR will double mark and space times.
Freescale Semiconductor, Inc...
MC68HC05RC17 -- Rev. 2.0 Carrier Modulator Transmitter (CMT) For More Information On This Product, Go to: www.freescale.com
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Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT) REQUIRED
9.5.3 Extended Space Operation In either time or FSK mode, the space period can be made longer than the maximum possible value of SBUFF. Setting the EXSPC bit in the MCSR will force the modulator to treat the next modulation period (beginning with the next load of MBUFF/SBUFF) as a space period equal in length to the mark and space counts combined. Subsequent modulation periods will consist entirely of these extended space periods with no mark periods. Clearing EXSPC will return the modulator to standard operation at the beginning of the next modulation period. To calculate the length of an extended space in time mode, use the equation:
texspace = ((SBUFF1)+(MBUFF2+1+SBUFF2) +... (MBUFFn+1+SBUFFn)) x 8 fosc secs
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AGREEMENT
Where the subscripts 1, 2, ... n refer to the modulation periods that elapsed while the EXSPC bit was set. Similarly, to calculate the length of an extended space in FSK mode, use the equation:
texspace = ((SBUFF1)+(MBUFF2+1+SBUFF2)+... (MBUFFn+1+SBUFFn)) fcg
secs
NON-DISCLOSURE
Where fcg is the frequency output from the carrier generator. For an example of extended space operation, see Figure 9-6.
NOTE:
The EXSPC feature can be used to emulate a zero mark event.
SET EXSPC
CLEAR EXSPC
Figure 9-6. Extended Space Operation
General Release Specification Carrier Modulator Transmitter (CMT) For More Information On This Product, Go to: www.freescale.com MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Carrier Modulator Transmitter (CMT) Modulator
9.5.3.1 End-of-Cycle (EOC) Interrupt At the end of each cycle (when the counter is reloaded from MBUFF), the end-of-cycle (EOC) flag is set. If the interrupt enable bit was previously set, an interrupt will also be issued to the CPU. The EOC interrupt provides a means for the user to reload new mark/space values into the MBUFF and SBUFF registers. As the EOC interrupt is coincident with reloading the counter, MBUFF does not require additional buffering and may be updated with a new value for the next period from within the EOC interrupt service routine (ISR). To allow both mark and space period values to be updated from within the same ISR, SREG is buffered by SBUFF. The contents written to SBUFF are transferred to the active register SREG at the end of every cycle irrespective of the state of the EOC flag. The EOC flag is cleared by a read of the modulator control and status register (MCSR) followed by an access of MDR2 or MDR3. The EOC flag must be cleared within the ISR to prevent another interrupt being generated after exiting the ISR. If the EOC interrupt is not being used (IE = 0), the EOC flag need not be cleared.
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MC68HC05RC17 -- Rev. 2.0 Carrier Modulator Transmitter (CMT) For More Information On This Product, Go to: www.freescale.com
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9.5.3.2 Modulator Control and Status Register The modulator control and status register (MCSR) contains the modulator and carrier generator enable (MCGEN), interrupt enable (IE), mode select (MODE), baseband enable (BASE), extended space (EXSPC), and external interrupt mask (EIMSK) control bits, divide-bytwo prescaler (DIV2) bit, and the end of cycle (EOC) status bit.
Address: $0014 Bit 7 Read: Write: Reset: 0 0 0 0 0 0 0 0 EOC DIV2 EIMSK EXSPC BASE MODE IE MCGEN 6 5 4 3 2 1 Bit 0
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= Unimplemented
Figure 9-7. Modulator Control and Status Register (MCSR) EOC -- End-Of-Cycle Status Flag 1 = End of modulator cycle (counter = SBUFF) has occurred 0 = Current modulation cycle in progress EOC is set when a match occurs between the contents of the space period register, SREG, and the down counter. This is recognized as the end of the modulation cycle. At this time, the counter is initialized with the (possibly new) contents of the mark period buffer, MBUFF, and the space period register, SREG, is loaded with the (possibly new) contents of the space period buffer, SBUFF. This flag is cleared by a read of the MCSR followed by an access of MDR2 or MDR3. The EOC flag is cleared by reset. DIV2 -- Divide-by-two prescaler 1 = Divide-by-two prescaler enabled 0 = Divide-by-two prescaler disabled The divide-by-two prescaler causes the CMT to be clocked at the bus rate when enabled; 2 x the bus rate when disabled (fosc). This bit is not double buffered and so should not be set during a transmission.
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General Release Specification Carrier Modulator Transmitter (CMT) For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Carrier Modulator Transmitter (CMT) Modulator
EIMSK -- External Interrupt Mask 1 = IRQ and keyscan interrupts masked 0 = IRQ and keyscan interrupts enabled The external interrupt mask bit is used to mask IRQ and keyscan interrupts. This bit is cleared by reset. EXSPC -- Extended Space Enable 1 = Extended space enabled 0 = Extended space disabled
Freescale Semiconductor, Inc...
BASE -- Baseband Enable 1 = Baseband enabled 0 = Baseband disabled When set, the BASE bit disables the carrier generator and forces the carrier output high for generation of baseband protocols. When BASE is clear, the carrier generator is enabled and the carrier output toggles at the frequency determined by values stored in the carrier data registers. See 9.5.1 Time Mode. This bit is cleared by reset. This bit is not double buffered and should not be written to during a transmission. MODE -- Mode Select 1 = CMT operates in FSK mode. 0 = CMT operates in time mode. For a description of CMT operation in time mode, see 9.5.1 Time Mode. For a description of CMT operation in FSK mode, see 9.5.2 FSK Mode. This bit is cleared by reset. This bit is not double buffered and should not be written to during a transmission. IE -- Interrupt Enable 1 = CPU interrupt enabled 0 = CPU interrupt disabled A CPU interrupt will be requested when EOC is set if IE was previously set. If IE is clear, EOC will not request a CPU interrupt.
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For a description of the extended space enable bit, see 9.5.3 Extended Space Operation. This bit is cleared by reset.
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Freescale Semiconductor, Inc. Carrier Modulator Transmitter (CMT) REQUIRED
MCGEN -- Modulator and Carrier Generator Enable 1 = Modulator and carrier generator enabled 0 = Modulator and carrier generator disabled Setting MCGEN will initialize the carrier generator and modulator and will enable all clocks. Once enabled, the carrier generator and modulator will function continuously. When MCGEN is cleared, the current modulator cycle will be allowed to expire before all carrier and modulator clocks are disabled (to save power) and the modulator output is forced low. The user should initialize all data and control registers before enabling the system to prevent spurious operation. This bit is cleared by reset.
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Carrier Modulator Transmitter (CMT) Modulator
9.5.4 Modulator Period Data Registers The 12-bit MBUFF and SBUFF registers are accessed through three 8bit registers, MDR1, MDR2, and MDR3. MDR2 and MDR3 contain the least significant eight bits of MBUFF and SBUFF respectively. MDR1 contains the two most significant nibbles of MBUFF and SBUFF. In many applications, periods greater than those obtained by eight bits will not be required. Splitting the registers up in this manner allows the user to clear MDR1 and generate 8-bit periods with just two data writes.
Freescale Semiconductor, Inc...
MDR1
Address: $0015 Bit 7 6 MB10 5 MB9 4 MB8 3 SB11 2 SB10 1 SB9 Bit 0 SB8
Read: MB11 Write: Reset: MDR2 Address: $0016 Bit 7 Read: MB7 Write: Reset: MDR3 Address: $0017 Bit 7 Read: SB7 Write: Reset: Unaffected by Reset SB6 SB5 SB4 SB3 SB2 SB1 SB0 6 5 4 3 2 1 Bit 0 Unaffected by Reset MB6 MB5 MB4 MB3 MB2 MB1 MB0 6 5 4 3 2 1 Bit 0 Unaffected by Reset
Figure 9-8. Modulator Data Registers (MDR1, MDR2, and MDR3)
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MC68HC05RC17 -- Rev. 2.0
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General Release Specification -- MC68HC05RC17
Section 10. Phase-Locked Loop (PLL) Synthesizer
10.1 Contents
10.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87 Operation During Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . .91 Noise Immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
Freescale Semiconductor, Inc...
10.4 10.5
10.2 Introduction
The phase-locked loop (PLL) consists of a variable bandwidth loop filter, a voltage controlled oscillator (VCO), a feedback frequency divider, and a digital phase detector. The PLL requires an external loop filter capacitor (typically 0.1 F) connected between XFC and VDDSYN. This capacitor should be located as close to the chip as possible to minimize noise. VDDSYN is the supply source for the PLL and should be bypassed to minimize noise. The VDDSYN bypass cap should be as close as possible to the chip. VDDSYN should be at the same potential as VDD. The phase detector compares the frequency and phase of the feedback frequency (tFB) and the crystal oscillator reference frequency (tREF) and generates the output, PCOMP, as shown in Figure 10-1. The output waveform is then integrated and amplified. The resultant dc voltage is applied to the voltage controlled oscillator. The output of the VCO is divided by a variable frequency divider of 128, 64, 32, or 16 to provide the feedback frequency for the phase detector.
MC68HC05RC17 -- Rev. 2.0 Phase-Locked Loop (PLL) Synthesizer For More Information On This Product, Go to: www.freescale.com
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10.3
Phase-Locked Loop Control Register. . . . . . . . . . . . . . . . . . . .89
REQUIRED
Freescale Semiconductor, Inc. Phase-Locked Loop (PLL) Synthesizer REQUIRED
VDDSYN
0.1 F OSC1 t REF CRYSTAL OSCILLATOR PCOMP
0.1 F
XFC PLLOUT TO CLOCK GENERATION CIRCUITRY
PHASE DETECT
LOOP FILTER
VCO
CLOCK SELECT
BCS tFB FREQUENCY DIVIDER
Freescale Semiconductor, Inc...
AGREEMENT
PS1
PS0
Figure 10-1. PLL Circuit To change PLL frequencies, follow this 6-step procedure: 1. Clear BCS to enable the low frequency bus rate 2. Clear PLLON to disable the PLL and select manual high bandwidth 3. Select the speed using PS1 and PS0 4. Set PLLON to enable the PLL 5. Wait a time of 90% tPLLS for the PLL frequency to stabilize and select manual low bandwidth, wait another 10% tPLLS
NON-DISCLOSURE
NOTE:
Typically, tPLLS equals 10 ms.
6. Set BCS to switch to the high-frequency bus rate The user cannot switch among the high speeds with the BCS bit set. Following the procedure above will prevent possible bursts of high frequency operation during the re-configuration of the PLL. Whenever the PLL is first enabled, the wide bandwidth mode is used. This enables the PLL frequency to ramp up quickly. When the output frequency is near the desired frequency, the filter is switched to the narrow bandwidth mode to make the final frequency more stable.
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MC68HC05RC17 -- Rev. 2.0
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Phase-Locked Loop (PLL) Synthesizer Phase-Locked Loop Control Register
10.3 Phase-Locked Loop Control Register
This read/write register contains the control bits that select the PLL frequency and enable/disable the synthesizer.
Address: $0007 Bit 7 Read: 0 BCS 0 0 0 BWC 0 PLLON 1 VCOTST 1 PS1 0 PS0 1 6 5 4 3 2 1 Bit 0
Freescale Semiconductor, Inc...
Write: Reset: 0
Figure 10-2. Phase-Locked Loop Control Register (PLLCR) BCS -- Bus Clock Select When this bit is set, the output of the PLL is used to generate the internal processor clock. When clear, the internal bus clock is driven by the crystal (OSC1/2). Once BCS has been changed, it may take up to 1.5 OSC1 cycles + 1.5 PLLOUT cycles to make the transition. During the transition, the clock select output will be held low and all CPU and timer activity will cease until the transition is complete. Before setting BCS, allow at least a time of tPLLS after PLLON is set. This bit should not be set unless the PLLON bit is already set on a previous instruction. Reset clears this bit. BWC -- Bandwidth Control This bit selects high bandwidth control when set and low bandwidth control when clear. The low bandwidth driver is always enabled, so this bit determines whether the high bandwidth driver is on or off. When the PLL is turned on, the BWC bit should be set to 1 for a time 90% tPLLS to allow the PLL time to acquire a frequency close to the desired frequency. The BWC bit should then be cleared and software should delay for a time, 10% tPLLS, to allow the PLL time to make the final adjustments. The PLL clock cannot be used (BCS bit set). Although it is NOT prohibited in hardware, the BCS bit should not be set unless the BWC bit is cleared and the proper delay times have been followed. The PLL will generate a lower jitter clock when the BWC bit is cleared. Reset clears this bit.
MC68HC05RC17 -- Rev. 2.0 Phase-Locked Loop (PLL) Synthesizer For More Information On This Product, Go to: www.freescale.com General Release Specification
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Freescale Semiconductor, Inc. Phase-Locked Loop (PLL) Synthesizer REQUIRED
PLLON -- PLL On This bit activates the synthesizer circuit without connecting it to the control circuit. This allows the synthesizer to stabilize before it can drive the CPU clocks. When this bit is cleared, the PLL is shut off and the BCS bit cannot be set. (Setting the BCS bit would engage the disabled PLL onto the bus). Reset sets this bit.
NOTE: NOTE:
For minimum current consumption, disable the PLL module before entering wait mode. The PLLON bit should not be cleared unless the BCS bit has been cleared on a previous write to the register.
VCOTST -- VCO Test
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NOTE:
This bit is intended for use by Freescale. This bit cannot be cleared in user mode.
PS1 and PS0 -- PLL Synthesizer Speed Select These two bits select one of four taps from the PLL to drive the CPU clocks. These bits are used in conjunction with PLLON and BCS bits in the PLL control register. Reset clears PS1 and sets PS0, choosing a bus clock frequency of 524 kHz using an external crystal of 32.768 kHz.
NON-DISCLOSURE
CAUTION:
This bit should not be modified if BCS and PLLON in the PLLCR are both at a logic high.
Table 10-1. PS1 and PS0 Speed Selects with 32.768-kHz Crystal
PS1 0 0 1 1 PS0 0 1 0 1 524 kHz 1.049 MHz 2.097 MHz 4.194 MHz Reset Condition For 3.0 V VDD 5.5 V Do Not Select CPU Bus Clock Frequency (fOP)
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MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Phase-Locked Loop (PLL) Synthesizer Operation During Stop Mode
NOTE:
For the MC68HC05RC17, the 4.194-MHz bus clock frequency should not be selected. The 2.097-MHz bus clock frequency should not be selected when running the part below VDD = 3.0 V.
10.4 Operation During Stop Mode
The PLL is switched to low-frequency bus rate and is turned off temporarily when STOP is executed. Coming out of stop mode with an external IRQ, the PLL is turned on with the same configuration it had before going into STOP with the exception of BCS which is reset. Otherwise, the PLL control register is in the reset condition.
Freescale Semiconductor, Inc...
10.5 Noise Immunity
The MCU should be insulated as much as possible from noise in the system. These steps are recommend to help prevent problems due to noise injection. 1. The application environment should be designed so that the MCU is not near signal traces which switch often, such as a clock signal. 2. The oscillator circuit for the MCU should be placed as close as possible to the OSC1 and OSC2 pins on the MCU. 3. To minimize noise, all power pins should be filtered by using bypass capacitors placed as close as possible to the MCU. See the application note Designing for Electromagnetic Compatibility (EMC) with HCMOS Microcontrollers, available through the Freescale Literature Distribution Center, document number AN1050/D.
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General Release Specification Phase-Locked Loop (PLL) Synthesizer For More Information On This Product, Go to: www.freescale.com
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MC68HC05RC17 -- Rev. 2.0
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General Release Specification -- MC68HC05RC17
Section 11. Instruction Set
11.1 Contents
11.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94
Freescale Semiconductor, Inc...
11.3 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94 11.3.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 11.3.2 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 11.3.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 11.3.4 Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95 11.3.5 Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96 11.3.6 Indexed, 8-Bit Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96 11.3.7 Indexed,16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96 11.3.8 Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97 11.4 Instruction Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97 11.4.1 Register/Memory Instructions . . . . . . . . . . . . . . . . . . . . . . .98 11.4.2 Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . .99 11.4.3 Jump/Branch Instructions . . . . . . . . . . . . . . . . . . . . . . . . .100 11.4.4 Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . .102 11.4.5 Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103 11.5 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
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Freescale Semiconductor, Inc. Instruction Set REQUIRED 11.2 Introduction
The MCU instruction set has 62 instructions and uses eight addressing modes. The instructions include all those of the M146805 CMOS Family plus one more: the unsigned multiply (MUL) instruction. The MUL instruction allows unsigned multiplication of the contents of the accumulator (A) and the index register (X). The high-order product is stored in the index register, and the low-order product is stored in the accumulator.
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11.3 Addressing Modes
The CPU uses eight addressing modes for flexibility in accessing data. The addressing modes provide eight different ways for the CPU to find the data required to execute an instruction. The eight addressing modes are: * * * * * * * * Inherent Immediate Direct Extended Indexed, no offset Indexed, 8-bit offset Indexed, 16-bit offset Relative
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MC68HC05RC17 -- Rev. 2.0 Instruction Set For More Information On This Product, Go to: www.freescale.com
Freescale Semiconductor, Inc.
Instruction Set Addressing Modes
11.3.1 Inherent Inherent instructions are those that have no operand, such as return from interrupt (RTI) and stop (STOP). Some of the inherent instructions act on data in the CPU registers, such as set carry flag (SEC) and increment accumulator (INCA). Inherent instructions require no operand address and are one byte long.
11.3.2 Immediate
Freescale Semiconductor, Inc...
Immediate instructions are those that contain a value to be used in an operation with the value in the accumulator or index register. Immediate instructions require no operand address and are two bytes long. The opcode is the first byte, and the immediate data value is the second byte.
11.3.3 Direct Direct instructions can access any of the first 256 memory locations with two bytes. The first byte is the opcode, and the second is the low byte of the operand address. In direct addressing, the CPU automatically uses $00 as the high byte of the operand address.
11.3.4 Extended Extended instructions use three bytes and can access any address in memory. The first byte is the opcode; the second and third bytes are the high and low bytes of the operand address. When using the Freescale assembler, the programmer does not need to specify whether an instruction is direct or extended. The assembler automatically selects the shortest form of the instruction.
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Freescale Semiconductor, Inc. Instruction Set REQUIRED
11.3.5 Indexed, No Offset Indexed instructions with no offset are 1-byte instructions that can access data with variable addresses within the first 256 memory locations. The index register contains the low byte of the effective address of the operand. The CPU automatically uses $00 as the high byte, so these instructions can address locations $0000-$00FF. Indexed, no offset instructions are often used to move a pointer through a table or to hold the address of a frequently used RAM or I/O location.
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11.3.6 Indexed, 8-Bit Offset Indexed, 8-bit offset instructions are 2-byte instructions that can access data with variable addresses within the first 511 memory locations. The CPU adds the unsigned byte in the index register to the unsigned byte following the opcode. The sum is the effective address of the operand. These instructions can access locations $0000-$01FE. Indexed 8-bit offset instructions are useful for selecting the kth element in an n-element table. The table can begin anywhere within the first 256 memory locations and could extend as far as location 510 ($01FE). The k value is typically in the index register, and the address of the beginning of the table is in the byte following the opcode.
NON-DISCLOSURE
11.3.7 Indexed,16-Bit Offset Indexed, 16-bit offset instructions are 3-byte instructions that can access data with variable addresses at any location in memory. The CPU adds the unsigned byte in the index register to the two unsigned bytes following the opcode. The sum is the effective address of the operand. The first byte after the opcode is the high byte of the 16-bit offset; the second byte is the low byte of the offset. Indexed, 16-bit offset instructions are useful for selecting the kth element in an n-element table anywhere in memory. As with direct and extended addressing, the Freescale assembler determines the shortest form of indexed addressing.
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Instruction Set Instruction Types
11.3.8 Relative Relative addressing is only for branch instructions. If the branch condition is true, the CPU finds the effective branch destination by adding the signed byte following the opcode to the contents of the program counter. If the branch condition is not true, the CPU goes to the next instruction. The offset is a signed, two's complement byte that gives a branching range of -128 to +127 bytes from the address of the next location after the branch instruction.
Freescale Semiconductor, Inc...
11.4 Instruction Types
The MCU instructions fall into the following five categories: * * * * * Register/Memory Instructions Read-Modify-Write Instructions Jump/Branch Instructions Bit Manipulation Instructions Control Instructions
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General Release Specification
NON-DISCLOSURE
AGREEMENT
When using the Freescale assembler, the programmer does not need to calculate the offset, because the assembler determines the proper offset and verifies that it is within the span of the branch.
REQUIRED
Freescale Semiconductor, Inc. Instruction Set REQUIRED
11.4.1 Register/Memory Instructions These instructions operate on CPU registers and memory locations. Most of them use two operands. One operand is in either the accumulator or the index register. The CPU finds the other operand in memory. Table 11-1. Register/Memory Instructions
Instruction Mnemonic ADC ADD AND BIT CMP CPX EOR LDA LDX MUL ORA SBC STA STX SUB Add Memory Byte and Carry Bit to Accumulator Add Memory Byte to Accumulator AND Memory Byte with Accumulator Bit Test Accumulator Compare Accumulator Compare Index Register with Memory Byte EXCLUSIVE OR Accumulator with Memory Byte Load Accumulator with Memory Byte Load Index Register with Memory Byte Multiply OR Accumulator with Memory Byte Subtract Memory Byte and Carry Bit from Accumulator Store Accumulator in Memory Store Index Register in Memory Subtract Memory Byte from Accumulator
NON-DISCLOSURE
General Release Specification
Freescale Semiconductor, Inc...
AGREEMENT
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Freescale Semiconductor, Inc.
Instruction Set Instruction Types
11.4.2 Read-Modify-Write Instructions These instructions read a memory location or a register, modify its contents, and write the modified value back to the memory location or to the register.
NOTE:
Do not use read-modify-write operations on write-only registers.
Table 11-2. Read-Modify-Write Instructions
Instruction Mnemonic ASL ASR BCLR(1) BSET(1) CLR COM DEC INC LSL LSR NEG ROL ROR TST(2)
Freescale Semiconductor, Inc...
Arithmetic Shift Left (Same as LSL) Arithmetic Shift Right Bit Clear Bit Set Clear Register Complement (One's Complement) Decrement Increment Logical Shift Left (Same as ASL) Logical Shift Right Negate (Two's Complement) Rotate Left through Carry Bit Rotate Right through Carry Bit Test for Negative or Zero
1. Unlike other read-modify-write instructions, BCLR and BSET use only direct addressing. 2. TST is an exception to the read-modify-write sequence because it does not write a replacement value.
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NON-DISCLOSURE
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REQUIRED
Freescale Semiconductor, Inc. Instruction Set REQUIRED
11.4.3 Jump/Branch Instructions Jump instructions allow the CPU to interrupt the normal sequence of the program counter. The unconditional jump instruction (JMP) and the jump-to-subroutine instruction (JSR) have no register operand. Branch instructions allow the CPU to interrupt the normal sequence of the program counter when a test condition is met. If the test condition is not met, the branch is not performed. The BRCLR and BRSET instructions cause a branch based on the state of any readable bit in the first 256 memory locations. These 3-byte instructions use a combination of direct addressing and relative addressing. The direct address of the byte to be tested is in the byte following the opcode. The third byte is the signed offset byte. The CPU finds the effective branch destination by adding the third byte to the program counter if the specified bit tests true. The bit to be tested and its condition (set or clear) is part of the opcode. The span of branching is from -128 to +127 from the address of the next location after the branch instruction. The CPU also transfers the tested bit to the carry/borrow bit of the condition code register.
NON-DISCLOSURE
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AGREEMENT
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Instruction Set Instruction Types
Table 11-3. Jump and Branch Instructions
Instruction Branch if Carry Bit Clear Branch if Carry Bit Set Branch if Equal Branch if Half-Carry Bit Clear Branch if Half-Carry Bit Set Branch if Higher Mnemonic BCC BCS BEQ BHCC BHCS BHI BIH BIL BLO BLS BMC BMI BMS BNE BPL BRA BRCLR BRN BRSET BSR JMP JSR BHS
Freescale Semiconductor, Inc...
Branch if IRQ Pin High Branch if IRQ Pin Low Branch if Lower Branch if Lower or Same Branch if Interrupt Mask Clear Branch if Minus Branch if Interrupt Mask Set Branch if Not Equal Branch if Plus Branch Always Branch if Bit Clear Branch Never Branch if Bit Set Branch to Subroutine Unconditional Jump Jump to Subroutine
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General Release Specification
NON-DISCLOSURE
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Branch if Higher or Same
REQUIRED
Freescale Semiconductor, Inc. Instruction Set REQUIRED
11.4.4 Bit Manipulation Instructions The CPU can set or clear any writable bit in the first 256 bytes of memory, which includes I/O registers and on-chip RAM locations. The CPU can also test and branch based on the state of any bit in any of the first 256 memory locations. Table 11-4. Bit Manipulation Instructions
Instruction Mnemonic BCLR BRCLR BRSET BSET
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AGREEMENT
Bit Clear Branch if Bit Clear Branch if Bit Set Bit Set
NON-DISCLOSURE
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MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Instruction Set Instruction Types
11.4.5 Control Instructions These instructions act on CPU registers and control CPU operation during program execution. Table 11-5. Control Instructions
Instruction Clear Carry Bit Clear Interrupt Mask Mnemonic CLC CLI NOP RSP RTI RTS SEC SEI STOP SWI TAX TXA
WAIT
Freescale Semiconductor, Inc...
No Operation Reset Stack Pointer Return from Interrupt Return from Subroutine Set Carry Bit Set Interrupt Mask Stop Oscillator and Enable IRQ Pin Software Interrupt Transfer Accumulator to Index Register Transfer Index Register to Accumulator Stop CPU Clock and Enable Interrupts
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General Release Specification
NON-DISCLOSURE
AGREEMENT
REQUIRED
Freescale Semiconductor, Inc. Instruction Set REQUIRED 11.5 Instruction Set Summary
Table 11-6. Instruction Set Summary
Opcode Source Form
ADC #opr ADC opr ADC opr ADC opr,X ADC opr,X ADC ,X ADD #opr ADD opr ADD opr ADD opr,X ADD opr,X ADD ,X AND #opr AND opr AND opr AND opr,X AND opr,X AND ,X ASL opr ASLA ASLX ASL opr,X ASL ,X ASR opr ASRA ASRX ASR opr,X ASR ,X BCC rel
Operation
Description
H I NZC
Add with Carry
A (A) + (M) + (C)
--
Freescale Semiconductor, Inc...
AGREEMENT
IMM DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX DIR INH INH IX1 IX REL
ii A9 2 B9 dd 3 C9 hh ll 4 D9 ee ff 5 E9 ff 4 F9 3 AB ii 2 BB dd 3 CB hh ll 4 DB ee ff 5 EB ff 4 FB 3 ii A4 2 B4 dd 3 C4 hh ll 4 D4 ee ff 5 E4 ff 4 F4 3 38 48 58 68 78 37 47 57 67 77 24 11 13 15 17 19 1B 1D 1F 25 27 28 29 22 24 dd 5 3 3 6 5 5 3 3 6 5 3 5 5 5 5 5 5 5 5 3 3 3 3 3 3
Add without Carry
A (A) + (M)
--
Logical AND
A (A) (M)
----
--
Arithmetic Shift Left (Same as LSL)
C b7 b0
0
----
NON-DISCLOSURE
ff dd
Arithmetic Shift Right
C b7 b0
----
ff rr dd dd dd dd dd dd dd dd rr rr rr rr rr rr
Branch if Carry Bit Clear
PC (PC) + 2 + rel ? C = 0
----------
BCLR n opr
Clear Bit n
Mn 0
DIR (b0) DIR (b1) DIR (b2) DIR (b3) ---------- DIR (b4) DIR (b5) DIR (b6) DIR (b7) ---------- ---------- ---------- ---------- ---------- ---------- REL REL REL REL REL REL
BCS rel BEQ rel BHCC rel BHCS rel BHI rel BHS rel
Branch if Carry Bit Set (Same as BLO) Branch if Equal Branch if Half-Carry Bit Clear Branch if Half-Carry Bit Set Branch if Higher Branch if Higher or Same
PC (PC) + 2 + rel ? C = 1 PC (PC) + 2 + rel ? Z = 1 PC (PC) + 2 + rel ? H = 0 PC (PC) + 2 + rel ? H = 1 PC (PC) + 2 + rel ? C Z = 0 PC (PC) + 2 + rel ? C = 0
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Cycles
Effect on CCR
Operand
Address Mode
Freescale Semiconductor, Inc.
Instruction Set Instruction Set Summary
Table 11-6. Instruction Set Summary (Continued)
Opcode Source Form
BIH rel BIL rel BIT #opr BIT opr BIT opr BIT opr,X BIT opr,X BIT ,X BLO rel BLS rel BMC rel BMI rel BMS rel BNE rel BPL rel BRA rel
Operation
Branch if IRQ Pin High Branch if IRQ Pin Low
Description
PC (PC) + 2 + rel ? IRQ = 1 PC (PC) + 2 + rel ? IRQ = 0
H I NZC
---------- ----------
REL REL IMM DIR EXT IX2 IX1 IX REL REL REL REL REL REL REL REL
2F 2E A5 B5 C5 D5 E5 F5 25 23 2C 2B 2D 26 2A 20 01 03 05 07 09 0B 0D 0F 21 00 02 04 06 08 0A 0C 0E 10 12 14 16 18 1A 1C 1E AD 98 9A
rr rr ii dd hh ll ee ff ff rr rr rr rr rr rr rr rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd rr dd dd dd dd dd dd dd dd rr
Bit Test Accumulator with Memory Byte
(A) (M)
----
--
Freescale Semiconductor, Inc...
Cycles
3 3 2 3 4 5 4 3 3 3 3 3 3 3 3 3 5 5 5 5 5 5 5 5 3 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 6 2 2
Effect on CCR
Branch if Lower (Same as BCS) Branch if Lower or Same Branch if Interrupt Mask Clear Branch if Minus Branch if Interrupt Mask Set Branch if Not Equal Branch if Plus Branch Always
PC (PC) + 2 + rel ? C = 1 PC (PC) + 2 + rel ? C Z = 1 PC (PC) + 2 + rel ? I = 0 PC (PC) + 2 + rel ? N = 1 PC (PC) + 2 + rel ? I = 1 PC (PC) + 2 + rel ? Z = 0 PC (PC) + 2 + rel ? N = 0 PC (PC) + 2 + rel ? 1 = 1
---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------
BRCLR n opr rel Branch if Bit n Clear
PC (PC) + 2 + rel ? Mn = 0
DIR (b0) DIR (b1) DIR (b2) DIR (b3) -------- DIR (b4) DIR (b5) DIR (b6) DIR (b7) ---------- REL DIR (b0) DIR (b1) DIR (b2) DIR (b3) -------- DIR (b4) DIR (b5) DIR (b6) DIR (b7) DIR (b0) DIR (b1) DIR (b2) DIR (b3) ---------- DIR (b4) DIR (b5) DIR (b6) DIR (b7) ---------- -------- 0 -- 0 ------ REL INH INH
BRN rel
Branch Never
PC (PC) + 2 + rel ? 1 = 0
BRSET n opr rel Branch if Bit n Set
PC (PC) + 2 + rel ? Mn = 1
BSET n opr
Set Bit n
Mn 1
BSR rel CLC CLI
Branch to Subroutine Clear Carry Bit Clear Interrupt Mask
PC (PC) + 2; push (PCL) SP (SP) - 1; push (PCH) SP (SP) - 1 PC (PC) + rel C0 I0
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General Release Specification
NON-DISCLOSURE
AGREEMENT
REQUIRED
Operand
Address Mode
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Table 11-6. Instruction Set Summary (Continued)
Opcode Source Form
CLR opr CLRA CLRX CLR opr,X CLR ,X CMP #opr CMP opr CMP opr CMP opr,X CMP opr,X CMP ,X COM opr COMA COMX COM opr,X COM ,X CPX #opr CPX opr CPX opr CPX opr,X CPX opr,X CPX ,X DEC opr DECA DECX DEC opr,X DEC ,X EOR #opr EOR opr EOR opr EOR opr,X EOR opr,X EOR ,X INC opr INCA INCX INC opr,X INC ,X JMP opr JMP opr JMP opr,X JMP opr,X JMP ,X
Operation
Description
M $00 A $00 X $00 M $00 M $00
H I NZC
Clear Byte
---- 0 1 --
DIR INH INH IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX DIR EXT IX2 IX1 IX
3F 4F 5F 6F 7F
dd
ff
AGREEMENT
Freescale Semiconductor, Inc...
Compare Accumulator with Memory Byte
(A) - (M)
----
ii A1 2 B1 dd 3 C1 hh ll 4 D1 ee ff 5 E1 ff 4 F1 3 33 43 53 63 73 dd 5 3 3 6 5
Complement Byte (One's Complement)
M (M) = $FF - (M) A (A) = $FF - (A) X (X) = $FF - (X) M (M) = $FF - (M) M (M) = $FF - (M)
----
1
ff
Compare Index Register with Memory Byte
(X) - (M)
----
ii A3 2 B3 dd 3 C3 hh ll 4 D3 ee ff 5 E3 ff 4 F3 3 3A 4A 5A 6A 7A dd 5 3 3 6 5
NON-DISCLOSURE
Decrement Byte
M (M) - 1 A (A) - 1 X (X) - 1 M (M) - 1 M (M) - 1
----
--
ff
EXCLUSIVE OR Accumulator with Memory Byte
A (A) (M)
----
--
ii A8 2 B8 dd 3 C8 hh ll 4 D8 ee ff 5 E8 ff 4 F8 3 3C 4C 5C 6C 7C dd 5 3 3 6 5
Increment Byte
M (M) + 1 A (A) + 1 X (X) + 1 M (M) + 1 M (M) + 1
----
--
ff
Unconditional Jump
PC Jump Address
----------
BC dd 2 CC hh ll 3 DC ee ff 4 EC ff 3 FC 2
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MC68HC05RC17 -- Rev. 2.0
Cycles
5 3 3 6 5
Effect on CCR
Operand
Address Mode
Freescale Semiconductor, Inc.
Instruction Set Instruction Set Summary
Table 11-6. Instruction Set Summary (Continued)
Opcode Source Form
JSR opr JSR opr JSR opr,X JSR opr,X JSR ,X LDA #opr LDA opr LDA opr LDA opr,X LDA opr,X LDA ,X LDX #opr LDX opr LDX opr LDX opr,X LDX opr,X LDX ,X LSL opr LSLA LSLX LSL opr,X LSL ,X LSR opr LSRA LSRX LSR opr,X LSR ,X MUL NEG opr NEGA NEGX NEG opr,X NEG ,X NOP ORA #opr ORA opr ORA opr ORA opr,X ORA opr,X ORA ,X ROL opr ROLA ROLX ROL opr,X ROL ,X
Operation
Description
H I NZC
PC (PC) + n (n = 1, 2, or 3) Push (PCL); SP (SP) - 1 Push (PCH); SP (SP) - 1 PC Effective Address
Jump to Subroutine
----------
DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX DIR INH INH IX1 IX INH DIR INH INH IX1 IX INH IMM DIR EXT IX2 IX1 IX DIR INH INH IX1 IX
BD dd 5 CD hh ll 6 DD ee ff 7 ED ff 6 FD 5 ii A6 2 B6 dd 3 C6 hh ll 4 D6 ee ff 5 E6 ff 4 F6 3 AE ii 2 BE dd 3 CE hh ll 4 DE ee ff 5 EE ff 4 FE 3 38 48 58 68 78 34 44 54 64 74 42 30 40 50 60 70 9D AA BA CA DA EA FA 39 49 59 69 79 ii dd hh ll ee ff ff dd dd dd 5 3 3 6 5 5 3 3 6 5 11 5 3 3 6 5 2 2 3 4 5 4 3 5 3 3 6 5
Freescale Semiconductor, Inc...
Load Index Register with Memory Byte
X (M)
----
--
Logical Shift Left (Same as ASL)
C b7 b0
0
----
ff dd
Logical Shift Right
0 b7 b0
C
---- 0
Unsigned Multiply
X : A (X) x (A) M -(M) = $00 - (M) A -(A) = $00 - (A) X -(X) = $00 - (X) M -(M) = $00 - (M) M -(M) = $00 - (M)
0 ------ 0
Negate Byte (Two's Complement)
----
ff
No Operation
----------
Logical OR Accumulator with Memory
A (A) (M)
----
--
Rotate Byte Left through Carry Bit
C b7 b0
----
ff
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General Release Specification
NON-DISCLOSURE
ff
AGREEMENT
Load Accumulator with Memory Byte
A (M)
----
--
Cycles
Effect on CCR
REQUIRED
Operand
Address Mode
Freescale Semiconductor, Inc. Instruction Set REQUIRED
Table 11-6. Instruction Set Summary (Continued)
Opcode Source Form
ROR opr RORA RORX ROR opr,X ROR ,X RSP
Operation
Description
H I NZC
Rotate Byte Right through Carry Bit
C b7 b0
----
DIR INH INH IX1 IX INH
36 46 56 66 76 9C
dd
ff
Reset Stack Pointer
SP $00FF SP (SP) + 1; Pull (CCR) SP (SP) + 1; Pull (A) SP (SP) + 1; Pull (X) SP (SP) + 1; Pull (PCH) SP (SP) + 1; Pull (PCL) SP (SP) + 1; Pull (PCH) SP (SP) + 1; Pull (PCL)
----------
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AGREEMENT
RTI
Return from Interrupt

INH
80
RTS SBC #opr SBC opr SBC opr SBC opr,X SBC opr,X SBC ,X SEC SEI STA opr STA opr STA opr,X STA opr,X STA ,X STOP STX opr STX opr STX opr,X STX opr,X STX ,X SUB #opr SUB opr SUB opr SUB opr,X SUB opr,X SUB ,X
Return from Subroutine
----------
INH IMM DIR EXT IX2 IX1 IX INH INH DIR EXT IX2 IX1 IX INH DIR EXT IX2 IX1 IX IMM DIR EXT IX2 IX1 IX
81
Subtract Memory Byte and Carry Bit from Accumulator
A (A) - (M) - (C)
----
ii A2 2 B2 dd 3 C2 hh ll 4 D2 ee ff 5 E2 ff 4 F2 3 99 9B B7 C7 D7 E7 F7 8E BF CF DF EF FF dd hh ll ee ff ff dd hh ll ee ff ff 2 2 4 5 6 5 4 2 4 5 6 5 4
Set Carry Bit Set Interrupt Mask
C1 I1
-------- 1 -- 1 ------
NON-DISCLOSURE
Store Accumulator in Memory
M (A)
----
--
Stop Oscillator and Enable IRQ Pin
-- 0 ------
Store Index Register In Memory
M (X)
----
--
Subtract Memory Byte from Accumulator
A (A) - (M)
----
ii A0 2 B0 dd 3 C0 hh ll 4 D0 ee ff 5 E0 ff 4 F0 3
SWI
Software Interrupt
PC (PC) + 1; Push (PCL) SP (SP) - 1; Push (PCH) SP (SP) - 1; Push (X) SP (SP) - 1; Push (A) -- 1 ------ SP (SP) - 1; Push (CCR) SP (SP) - 1; I 1 PCH Interrupt Vector High Byte PCL Interrupt Vector Low Byte X (A) ----------
INH
83
10
TAX
Transfer Accumulator to Index Register
INH
97
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MC68HC05RC17 -- Rev. 2.0
Cycles
5 3 3 6 5 2 9 6 2
Effect on CCR
Operand
Address Mode
Freescale Semiconductor, Inc.
Instruction Set Instruction Set Summary
Table 11-6. Instruction Set Summary (Continued)
Opcode Source Form
TST opr TSTA TSTX TST opr,X TST ,X TXA
Operation
Description
H I NZC
Test Memory Byte for Negative or Zero
(M) - $00
----
--
DIR INH INH IX1 IX INH INH
3D 4D 5D 6D 7D 9F 8F
dd
ff
Transfer Index Register to Accumulator Stop CPU Clock and Enable Interrupts Accumulator Carry/borrow ag Condition code register Direct address of operand Direct address of operand and relative offset of branch instruction Direct addressing mode High and low bytes of offset in indexed, 16-bit offset addressing Extended addressing mode Offset byte in indexed, 8-bit offset addressing Half-carry ag High and low bytes of operand address in extended addressing Interrupt mask Immediate operand byte Immediate addressing mode Inherent addressing mode Indexed, no offset addressing mode Indexed, 8-bit offset addressing mode Indexed, 16-bit offset addressing mode Memory location Negative ag Any bit
A (X)
---------- -- 0 ------
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WAIT A C CCR dd dd rr DIR ee ff EXT ff H hh ll I ii IMM INH IX IX1 IX2 M N n
Cycles
4 3 3 5 4 2 2
Effect on CCR
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General Release Specification
NON-DISCLOSURE
opr PC PCH PCL REL rel rr SP X Z # () -( ) ? : --
Operand (one or two bytes) Program counter Program counter high byte Program counter low byte Relative addressing mode Relative program counter offset byte Relative program counter offset byte Stack pointer Index register Zero ag Immediate value Logical AND Logical OR Logical EXCLUSIVE OR Contents of Negation (two's complement) Loaded with If Concatenated with Set or cleared Not affected
AGREEMENT
REQUIRED
Operand
Address Mode
N O N - D I S C LFreescale Semiconductor, IN T OSURE A G R E E M E nc... R E Q U I R E D
Table 11-7. Opcode Map
Branch Register/Memory IMM IX F
SUB CMP SBC CPX AND BIT LDA STA 2 EOR ADC ORA 1 1 1 1 ADD JMP 2 JSR LDX STX 2 MSB LSB 3 IX 3 IX 3 IX 3 IX 3 IX 3 IX 3 IX 4 IX 3 IX 3 IX 3 IX 3 IX 2 IX 5 IX 3 IX 4 IX MSB LSB
Bit Manipulation Control IX INH INH IX1 E 9
2 2 2 2 2 2 2
Read-Modify-Write DIR INH INH 5 6 7 8 D A B C IX2 4 EXT 3 IX1 DIR
DIR REL 2
DIR
MSB LSB
0
1
Instruction Set
0 1 2 3 4 5 6 7 8 9 A B C D E F
0
1
9 RTI INH 6 RTS INH
General Release Specification
10 SWI INH 2 SUB IMM 2 2 CMP IMM 2 2 SBC IMM 2 2 CPX IMM 2 2 AND IMM 2 2 BIT IMM 2 2 LDA IMM 2 1 1 1 2 EOR IMM 2 2 ADC IMM 2 2 ORA IMM 2 2 ADD IMM 2 2 TAX INH 2 CLC INH 2 2 SEC INH 2 2 CLI INH 2 2 SEI INH 2 2 RSP INH 2 NOP INH 2 6 BSR REL 2 2 LDX 2 IMM 2 2 STOP INH 2 2 TXA WAIT INH 1 INH 3 SUB DIR 3 3 CMP DIR 3 3 SBC DIR 3 3 CPX DIR 3 3 AND DIR 3 3 BIT DIR 3 3 LDA DIR 3 4 STA DIR 3 3 EOR DIR 3 3 ADC DIR 3 3 ORA DIR 3 3 ADD DIR 3 2 JMP DIR 3 5 JSR DIR 3 3 LDX DIR 3 4 STX DIR 3 4 SUB EXT 3 4 CMP EXT 3 4 SBC EXT 3 4 CPX EXT 3 4 AND EXT 3 4 BIT EXT 3 4 LDA EXT 3 5 STA EXT 3 4 EOR EXT 3 4 ADC EXT 3 4 ORA EXT 3 4 ADD EXT 3 3 JMP EXT 3 6 JSR EXT 3 4 LDX EXT 3 5 STX EXT 3 5 SUB IX2 2 5 CMP IX2 2 5 SBC IX2 2 5 CPX IX2 2 5 AND IX2 2 5 BIT IX2 2 5 LDA IX2 2 6 STA IX2 2 5 EOR IX2 2 5 ADC IX2 2 5 ORA IX2 2 5 ADD IX2 2 4 JMP IX2 2 7 JSR IX2 2 5 LDX IX2 2 6 STX IX2 2 4 SUB IX1 1 4 CMP IX1 1 4 SBC IX1 1 4 CPX IX1 1 4 AND IX1 1 4 BIT IX1 1 4 LDA IX1 1 5 STA IX1 1 4 EOR IX1 1 4 ADC IX1 1 4 ORA IX1 1 4 ADD IX1 1 3 JMP IX1 1 6 JSR IX1 1 4 LDX IX1 1 5 STX IX1 1
2
3
4
5
6
7
8
9
A
B
Freescale Semiconductor, Inc.
Instruction Set For More Information On This Product, Go to: www.freescale.com
0
LSB of Opcode in Hexadecimal REL = Relative IX = Indexed, No Offset IX1 = Indexed, 8-Bit Offset IX2 = Indexed, 16-Bit Offset
C
D
E
F
5 5 3 5 3 3 6 5 BRSET0 BRA BSET0 NEG NEGA NEGX NEG NEG 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 1 5 5 3 BRCLR0 BRN BCLR0 3 1 DIR 2 DIR 2 REL 5 11 5 3 BRSET1 MUL BHI BSET1 3 1 DIR 2 INH DIR 2 REL 5 5 3 5 3 3 6 5 BRCLR1 BLS BCLR1 COM COMA COMX COM COM 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 1 5 5 3 5 3 3 6 5 BRSET2 BCC BSET2 LSR LSRA LSRX LSR LSR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRCLR2 BCLR2 BCS/BLO 3 DIR 2 DIR 2 REL 5 5 3 5 3 3 6 5 BRSET3 BNE BSET3 ROR RORA RORX ROR ROR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRCLR3 BEQ BCLR3 ASR ASRA ASRX ASR ASR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRSET4 BHCC BSET4 ASL/LSL ASLA/LSLA ASLX/LSLX ASL/LSL ASL/LSL 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRCLR4 BHCS BCLR4 ROL ROLA ROLX ROL ROL 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 5 3 3 6 5 BRSET5 BPL BSET5 DEC DECA DECX DEC DEC 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRCLR5 BMI BCLR5 3 DIR 2 DIR 2 REL 5 5 3 5 3 3 6 5 BRSET6 BMC BSET6 INC INCA INCX INC INC 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 4 3 3 5 4 BRCLR6 BMS BCLR6 TST TSTA TSTX TST TST 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 5 5 3 BRSET7 BIL BSET7 3 1 DIR 2 DIR 2 REL 5 5 3 5 3 3 6 5 BRCLR7 BIH BCLR7 CLR CLRA CLRX CLR CLR 3 DIR 2 DIR 2 REL 2 DIR 1 INH 1 INH 2 IX1 1 IX 1
MSB of Opcode in Hexadecimal
MC68HC05RC17 -- Rev. 2.0
INH = Inherent IMM = Immediate DIR = Direct EXT = Extended
0
5 Number of Cycles BRSET0 Opcode Mnemonic 3 DIR Number of Bytes/Addressing Mode
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
Section 12. Electrical Specifications
12.1 Contents
12.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 DC Electrical Characteristics (5.0 Vdc). . . . . . . . . . . . . . . . . .114 DC Electrical Characteristics (3.3 Vdc). . . . . . . . . . . . . . . . . .115 DC Electrical Characteristics (2.2 Vdc). . . . . . . . . . . . . . . . . .116 Control Timing (3.3 Vdc and 5.0 Vdc). . . . . . . . . . . . . . . . . . .117
Freescale Semiconductor, Inc...
12.4 12.5 12.6 12.7 12.8 12.9
12.10 Control Timing (2.2 Vdc). . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
This section contains the electrical and timing specifications.
MC68HC05RC17 -- Rev. 2.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
NON-DISCLOSURE
12.2 Introduction
AGREEMENT
12.3
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
REQUIRED
Freescale Semiconductor, Inc. Electrical Specifications REQUIRED 12.3 Maximum Ratings
Maximum ratings are the extreme limits to which the MCU can be exposed without permanently damaging it. The MCU contains circuitry to protect the inputs against damage from high static voltages; however, do not apply voltages higher than those shown in the table below. Keep VIN and VOUT within the range VSS (VIN or VOUT) VDD. Connect unused inputs to the appropriate voltage level, either VSS or VDD.
Rating Supply Voltage Input Voltage Current Drain Per Pin Excluding VDD and VSS Operating Junction Temperature Storage Temperature Range Symbol VDD VIN I TJ Tstg Value -0.3 to +7.0 VSS -0.3 to VDD + 0.3 25 +150 -65 to +150 Unit V V mA C C
Freescale Semiconductor, Inc...
AGREEMENT
NOTE:
NON-DISCLOSURE
This device is not guaranteed to operate properly at the maximum ratings. Refer to 12.6 DC Electrical Characteristics (5.0 Vdc), 12.7 DC Electrical Characteristics (3.3 Vdc), and 12.8 DC Electrical Characteristics (2.2 Vdc) for guaranteed operating conditions.
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Electrical Specifications Operating Range
12.4 Operating Range
Characteristic Operating Temperature Range MC68HC05RC17 (Standard) Symbol TA Value TL to TH 0 to +70 Unit C
12.5 Thermal Characteristics
Freescale Semiconductor, Inc...
Characteristic Thermal Resistance Plastic Dual In-Line Package Small Outline Intergrated Circuit Package
Symbol JA
Value 60 60
Unit C/W
MC68HC05RC17 -- Rev. 2.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
NON-DISCLOSURE
AGREEMENT
REQUIRED
Freescale Semiconductor, Inc. Electrical Specifications REQUIRED 12.6 DC Electrical Characteristics (5.0 Vdc)
Characteristic Output Voltage ILoad = 10.0 A ILoad = -10.0 A Output High Voltage (ILoad -2.0 mA) Port A, Port B, Port C (1-7) (ILoad -20.0 mA) IRO (ILoad -4.0 mA) Port C (Bit 0) Output Low Voltage (ILoad = 3.0 mA) Port A, Port B, Port C (1-7) (ILoad = 25.0 mA) IRO (ILoad = 20.0 mA) Port C (Bit 0) Input High Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Input Low Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Input Hysteresis (RESET) Supply Current (see Notes) Run (fOP = 2.1 MHz) Wait with PLL Enabled (fOP = 2.1 MHz) Wait with PLL Disabled (fOP = 16.384 kHz) Stop 25 oC 0 oC to +70 oC I/O Ports Hi-Z Leakage Current Port A, Port B, Port C Input Current RESET, LPRST, IRQ, OSC1 PB0-PB7 with Pullups Enabled (VIN = 0.2 x VDD) PB0-PB7 with Pullups Enabled (VIN = 0.7 x VDD) Capacitance Ports (as Input or Output) RESET, LPRST, IRQ Symbol VOL VOH VOH Min -- VDD -0.1 VDD -0.8 VDD -0.7 VDD -0.8 -- -- -- 0.7 x VDD VSS 0.8 -- -- -- -- -- IOZ IIn -10 -1 -100 -50 -- -- Typ -- -- VDD -0.2 VDD -0.2 VDD -0.2 0.2 0.2 0.2 -- -- 0.9 3.1 1.1 39.2 0.4 0.4 -- -- -496 -169 -- -- Max 0.1 -- -- -- -- 0.4 0.8 0.4 VDD 0.2 x VDD 1 4.0 1.5 60.0 10.0 20.0 10 1 -700 -300 12 8 Unit V
V
Freescale Semiconductor, Inc...
AGREEMENT
VOL VIH VIL VHYST
V V V V mA mA A A A A A
IDD
NON-DISCLOSURE
NOTES: 1. VDD = 5.0 Vdc 10%, VSS = 0 Vdc, TA = 0 C to +70 C, unless otherwise noted 2. All values shown reflect average measurements. 3. All current measurements represent the summation of current through VDD and VDDSYN supply pins. 4. Typical values at midpoint of voltage range, 25 oC only 5. To minimize current consumption in wait mode, disable the PLL before executing the WAIT instruction. Internal bus speed will be that of the 32.768-kHz external frequency. 6. Wait IDD: only core timer active 7. Run (with PLL enabled) IDD, wait IDD (with PLL enabled): Measured using external square wave clock source (fOSC = 4.2 MHz); all inputs 0.2 V from rail; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2. Wait IDD (with PLL disabled): Measured using external square wave clock source (fOSC = 33 kHz). 8. Wait, stop IDD: Port A and port C configured as inputs; port B configured as outputs; VIL = 0.2 V; VIH = VDD -0.2 V 9. Stop IDD is measured with OSC1 = VSS. 10. Wait IDD is affected linearly by the OSC2 capacitance. 11. Pullups are designed to be capable of pulling to VIH within 10 s for a 100 pF, 4-k load.
COut CINT
pF
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Electrical Specifications DC Electrical Characteristics (3.3 Vdc)
12.7 DC Electrical Characteristics (3.3 Vdc)
Characteristic Output Voltage ILoad = 10.0 A ILoad = -10.0 A Output High Voltage (ILoad -0.8 mA) Port A, Port B, Port C (1-7) (ILoad -4.0 mA) IRO (ILoad -2.0 mA) Port C (Bit 0) Output Low Voltage (ILoad = 1.2 mA) Port A, Port B, Port C (1-7) (ILoad = 9.0 mA) IRO (ILoad = 8.0 mA) Port C (Bit 0) Input High Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Input Low Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Supply Current (see Notes) Run (fOP = 2.1 MHz) Wait with PLL Enabled (fOP = 2.1 MHz) Wait with PLL Disabled (fOP = 16.384 kHz) Stop 25 oC 0 oC to +70 oC I/O Ports Hi-Z Leakage Current Port A, Port B, Port C Input Current RESET, LPRST, IRQ, OSC1 PB0-PB7 with Pullups Enabled (VIN = 0.3 x VDD) PB0-PB7 with Pullups Enabled (VIN = 0.7 x VDD) Capacitance Ports (as Input or Output) RESET, LPRST, IRQ Symbol VOL VOH VOH Min -- VDD -0.1 VDD -0.3 VDD -0.7 VDD -0.3 -- -- -- 0.7 x VDD VSS -- -- -- -- -- IOZ IIn -6 -0.6 -50 -25 -- -- Typ -- -- VDD -0.1 VDD -0.1 VDD -0.1 0.1 0.1 0.1 -- -- 1.6 0.52 29.5 0.15 0.15 -- -- -209 -83 -- -- Max 0.1 -- -- -- -- 0.3 0.8 0.3 VDD 0.3 x VDD 2.0 1.0 50.0 4.0 8.0 6 0.6 -330 -180 12 8 Unit V
V
Freescale Semiconductor, Inc...
VIH VIL
V V mA mA A A A A
IDD
A
NOTES: 1. VDD = 3.3 Vdc 10%, VSS = 0 Vdc, TA = 0 C to +70 C, unless otherwise noted 2. All values shown reflect average measurements. 3. Typical values at midpoint of voltage range, 25 oC only 4. All current measurements represent the summation of current through VDD and VDDSYN supply pins. 5. To minimize current consumption in wait mode, disable the PLL before executing the WAIT instruction. Internal bus speed will be that of the 32.768-kHz external frequency. 6. Wait IDD: only core timer active 7. Run (with PLL enabled) IDD, wait IDD (with PLL enabled): Measured using external square wave clock source (fOSC = 4.2 MHz); all inputs 0.2 V from rail; no dc loads;; less than 50 pF on all outputs; CL = 20 pF on OSC2. Wait IDD (with PLL disabled): Measured using external square wave clock source (fosc = 33 kHz). 8. Wait, stop IDD: Port A and port C configured as inputs, port B configured as outputs; VIL = 0.2 V; VIH = VDD -0.2 V 9. Stop IDD is measured with OSC1 = VSS. 10. Wait IDD is affected linearly by the OSC2 capacitance. 11. Pullups are designed to be capable of pulling to VIH within 10 s for a 100 pF, 4-k load.
COut CINT
pF
MC68HC05RC17 -- Rev. 2.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
NON-DISCLOSURE
AGREEMENT
VOL
V
REQUIRED
Freescale Semiconductor, Inc. Electrical Specifications REQUIRED 12.8 DC Electrical Characteristics (2.2 Vdc)
Characteristic Output Voltage ILoad = 10.0 A ILoad = -10.0 A Output High Voltage (ILoad -0.6 mA) Port A, Port B, Port C (1-7) (ILoad -2.5 mA) IRO (ILoad -1.2 mA) Port C (Bit 0) Output Low Voltage (ILoad = 1.0 mA) Port A, Port B, Port C (1-7) (ILoad = 8.0 mA) IRO (ILoad = 7.0 mA) Port C (Bit 0) Input High Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Input Low Voltage Port A, Port B, Port C, IRQ, RESET, LPRST, OSC1 Supply Current (see Notes) Run (fOP = 1.0 MHz) Wait with PLL Enabled (fOP = 1.0 MHz) Wait with PLL Disabled (fOP = 16.384 kHz) Stop 25 oC 0 oC to +70 oC I/O Ports Hi-Z Leakage Current Port A, Port B, Port C Input Current RESET, LPRST, IRQ, OSC1 PB0-PB7 with Pullups Enabled (VIN = 0.4 x VDD) PB0-PB7 with Pullups Enabled (VIN = 0.7 x VDD) Capacitance Ports (as Input or Output) RESET, LPRST, IRQ Symbol VOL VOH VOH Min -- VDD -0.1 VDD -0.3 VDD -0.7 VDD -0.3 -- -- -- 0.7 x VDD VSS -- -- -- -- -- IOZ IIn -4 -0.4 -25 -15 -- -- Typ -- -- VDD -0.1 VDD -0.1 VDD -0.1 0.1 0.1 0.1 -- -- 0.5 0.2 21.0 0.1 0.1 -- -- -79 -35 -- -- Max 0.1 -- -- -- -- 0.3 0.8 0.3 VDD 0.4 x VDD 1.0 0.8 40.0 1.0 4.0 4 0.4 -105 -65 12 8 Unit V
V
Freescale Semiconductor, Inc...
AGREEMENT
VOL VIH VIL
V
V V mA mA A A A A
IDD
NON-DISCLOSURE
A
NOTES: 1. VDD = 2.2 Vdc 10%, VSS = 0 Vdc, TA = 0 C to +70 C, unless otherwise noted 2. All values shown reflect average measurements. 3. Typical values at midpoint of voltage range, 25 oC only 4. All current measurements represent the summation of current through VDD and VDDSYN supply pins. 5. To minimize current consumption in wait mode, disable the PLL before executing the WAIT instruction. Internal bus speed will be fosc of crystal / 2. 6. Wait IDD: only core timer active 7. Run (with PLL enabled) IDD, wait IDD (with PLL enabled): Measured using external square wave clock source (fOSC = 2.0 MHz); all inputs 0.2 V from rail; no dc loads; less than 50 pF on all outputs; CL = 20 pF on OSC2. Wait IDD (with PLL disabled): Measured using external square wave clock source (fosc = 33 kHz). 8. Wait, stop IDD: Port A and port C configured as inputs, port B configured as outputs, VIL = 0.2 V, VIH = VDD -0.2 V 9. Stop IDD is measured with OSC1 = VSS. 10. Wait IDD is affected linearly by the OSC2 capacitance. 11. Pullups are designed to be capable of pulling to VIH within 25 s for a 100 pF, 4-k load.
COut CINT
pF
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Electrical Specifications Control Timing (3.3 Vdc and 5.0 Vdc)
12.9 Control Timing (3.3 Vdc and 5.0 Vdc)
Characteristic Frequency of Operation Assumes use of 32.768-kHz Crystal Only Internal Operating Frequency Assumes use of 32.768-kHz Crystal Only fOP = fOSC / 2 if PLL is NO Driving Internal Bus T fOP = 32.768 kHz x N, where N = 16, 32, or 64 (Selectable) and PLL is Driving Internal Bus Symbol fOSC Min 32.768 Max 32.768 Unit kHz
fOP
-- 0.524
16.384 2.097 -- 100 100 -- -- -- --
kHz MHz ns ms ms tCYC ns tCYC ns
Freescale Semiconductor, Inc...
Crystal Oscillator Startup Time Assumes fOP = 2.097 MHz) Stop Recovery Startup Time (Crystal Oscillator) Assumes fOP = 2.097 MHz) RESET Pulse Width Assumes fOP = 2.097 MHz) Interrupt Pulse Width Low (Edge-Triggered) Assumes fOP = 2.097 MHz) Interrupt Pulse Period Assumes fOP = 2.097 MHz) OSC1 Pulse Width
tOXOV tILCH tRL tILIH tILIL tOH, tOL
-- -- 1.5 125 Note 2 90
NOTES: 1. VDD = 3.0 to 5.5 Vdc 10%, VSS = 0 Vdc, TA = 0 C to +70 C, unless otherwise noted 2. The minimum period, tILIL, should not be less than the number of cycle times it takes to execute the interrupt service routine plus 2T tCYC.
MC68HC05RC17 -- Rev. 2.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
NON-DISCLOSURE
AGREEMENT
Cycle Time Assumes fOP = 2.097 MHz
tCYC
480
REQUIRED
Freescale Semiconductor, Inc. Electrical Specifications REQUIRED 12.10 Control Timing (2.2 Vdc)
Characteristic Frequency of Operation Assumes Use of 32.768-kHz Crystal Only Internal Operating Frequency Assumes use of 32.768-kHz Crystal Only fOP = fOSC / 2 if PLL is NO Driving Internal Bus T fOP = 32.768 kHz x N, where N = 16, 32, or 64 (Selectable) and PLL is Driving Internal Bus Cycle Time Assumes fOP = 1.049 MHz Crystal Oscillator Startup Time Assumes fOP = 1.049 MHz Stop Recovery Startup Time (Crystal Oscillator) Assumes fOP = 1.049 MHz RESET Pulse Width Assumes fOP = 1.049 MHz Interrupt Pulse Width Low (Edge-Triggered) Assumes fOP = 1.049 MHz Interrupt Pulse Period Assumes fOP = 1.049 MHz OSC1 Pulse Width Symbol fOSC Min 32.768 Max 32.768 Unit kHz
fOP
-- 0.524
16.384 1.049 -- 200 200 -- -- -- --
kHz MHz ns ms ms tCYC ns tCYC ns
Freescale Semiconductor, Inc...
AGREEMENT
tCYC tOXOV tILCH tRL tILIH tILIL tOH, tOL
1000 -- -- 1.5 250 Note 2 180
NON-DISCLOSURE
NOTES: 1. VDD = 2.2 Vdc 10%, VSS = 0 Vdc, TA = 0 C to +70 C, unless otherwise noted 2. The minimum period, tILIL, should not be less than the number of cycle times it takes to execute the interrupt service routine plus 2T tCYC.
12.11
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Electrical Specifications
5.00 4.50 4.00 SUPPLY CURRENT (mA) 3.50 3.00 2.50 2.00 1.50 1.00 0.50
VDD = 5.5 V, TA = 0 C to +70 C 2.1 MHz SPECIFICATION LIMIT
RUN I DD
WAIT I DD
STOP IDD (20 A MAX) 0 0.5 1.0 1.5 2.0 2.5
Freescale Semiconductor, Inc...
0.00
INTERNAL BUS FREQUENCY (MHz) NOTE: Run and wait IDD measurements are with the PLL enabled. Stop IDD measurements are with the PLL disabled. Current values represent the summation of VDD and VDDSYN currents.
Figure 12-1. 5.5-Volt Maximum Supply Current vs Internal Clock Frequency
2.5
VDD = 3.6 V, TA = 0 C to +70 C 2.1 MHz SPECIFICATION LIMIT
RUN I DD
1.5
1.0
WAIT I DD
0.5 STOP IDD (8 A MAX) 0 0 0.5 1.0 1.5 2.0 2.5
INTERNAL BUS FREQUENCY (MHz) NOTE: Run and wait IDD measurements are with the PLL enabled. Stop IDD measurements are with the PLL disabled. Current values represent the summation of VDD and VDDSYN currents.
Figure 12-2. 3.6-Volt Maximum Supply Current vs Internal Clock Frequency
MC68HC05RC17 -- Rev. 2.0 Electrical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
NON-DISCLOSURE
2.0 SUPPLY CURRENT (mA)
AGREEMENT
REQUIRED
Freescale Semiconductor, Inc. Electrical Specifications REQUIRED
1.0 0.9 0.8 SUPPLY CURRENT (mA) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0
VDD = 2.4 V, TA = 0 C to +70 C
I DD RUN
WAI
T I DD
Freescale Semiconductor, Inc...
AGREEMENT
STOP IDD (4 A MAX) 0 0.2 0.4 0.6 0.8 1.0
INTERNAL BUS FREQUENCY (MHz) NOTE: Current values represent the summation of VDD and VDDSYN currents.
Figure 12-3. 2.4-Volt Maximum Supply Current vs Internal Clock Frequency
60 50 SUPPLY CURRENT (A) 40 30 20 10 EXTERNAL FREQUENCY = 32.768 kHz, TA = 0 C to +70 C 0 2.4 3.6 VDD (V) 5.5
NON-DISCLOSURE
NOTE: Current values represent summation of VDD and VDDSYN currents.
Figure 12-4. Maximum Wait Mode Supply Current vs VDD with PLL Disengaged
General Release Specification Electrical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
Section 13. Mechanical Specifications
13.1 Contents
13.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .121 28-Pin Small Outline Integrated Circuit Package (Case 751F-04) . . . . . . . . . . . . . . . . . . . .122
Freescale Semiconductor, Inc...
13.4
13.2 Introduction
This section describes the dimensions of the dual in-line package (DIP) and small outline integrated circuit (SOIC) MCU packages.
13.3 28-Pin Plastic Dual In-Line Package (Case 710-02) NON-DISCLOSURE
28
15
B
1 14
NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25mm (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0 15 0.51 1.02 INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0 15 0.020 0.040
A N
C
L
H
G F D
K
SEATING PLANE
M
J
MC68HC05RC17 -- Rev. 2.0 Mechanical Specifications For More Information On This Product, Go to: www.freescale.com
General Release Specification
AGREEMENT
13.3
28-Pin Plastic Dual In-Line Package (Case 710-02) . . . . . . .121
REQUIRED
Freescale Semiconductor, Inc. Mechanical Specifications REQUIRED 13.4 28-Pin Small Outline Integrated Circuit Package (Case 751F-04)
-A28 15 14X
-B1 14
P 0.010 (0.25)
M
B
M
28X D
0.010 (0.25)
M
T
A
S
B
S
M R X 45
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 17.80 18.05 7.60 7.40 2.65 2.35 0.49 0.35 0.90 0.41 1.27 BSC 0.32 0.23 0.29 0.13 8 0 10.05 10.55 0.75 0.25 INCHES MIN MAX 0.701 0.711 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 8 0 0.395 0.415 0.010 0.029
Freescale Semiconductor, Inc...
AGREEMENT
-T26X
C G K -TSEATING PLANE
F J
NON-DISCLOSURE
General Release Specification Mechanical Specifications For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
General Release Specification -- MC68HC05RC17
Section 14. Ordering Information
14.1 Contents
14.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123 Application Program Media. . . . . . . . . . . . . . . . . . . . . . . . . . .124 ROM Program Verification . . . . . . . . . . . . . . . . . . . . . . . . . . .125 ROM Verification Units (RVUs). . . . . . . . . . . . . . . . . . . . . . . .126 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
Freescale Semiconductor, Inc...
14.4 14.5 14.6 14.7
14.2 Introduction
This section contains instructions for ordering custom-masked ROM MCUs.
14.3 MCU Ordering Forms
To initiate an order for a ROM-based MCU, first obtain the current ordering form for the MCU from a Freescale representative. Submit the following items when ordering MCUs: * * * A current MCU ordering form that is completely filled out (Contact your Freescale sales office for assistance.) A copy of the customer specification if the customer specification deviates from the Freescale specification for the MCU Customer's application program on one of the media listed in 14.4 Application Program Media
MC68HC05RC17 -- Rev. 2.0 Ordering Information For More Information On This Product, Go to: www.freescale.com
General Release Specification
NON-DISCLOSURE
AGREEMENT
14.3
MCU Ordering Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123
REQUIRED
Freescale Semiconductor, Inc. Ordering Information REQUIRED
The current MCU ordering form is also available through the Freescale Freeware Bulletin Board Service (BBS). The telephone number is (512) 891-FREE. After making the connection, type bbs in lowercase letters. Then press the return key to start the BBS software.
14.4 Application Program Media
Please deliver the application program to Freescale in one of the following media: * * * Macintosh(R)1 3 1/2-inch diskette (double-sided 800 K or double-sided high-density 1.4 M) MS-DOS(R)2 or PC-DOSTM3 3 1/2-inch diskette (double-sided 720 K or double-sided high-density 1.44 M) MS-DOS(R) or PC-DOSTM 5 1/4-inch diskette (double-sided double-density 360 K or double-sided high-density 1.2 M)
Freescale Semiconductor, Inc...
AGREEMENT
Use positive logic for data and addresses. When submitting the application program on a diskette, clearly label the diskette with the following information: * * * * * * * Customer name Customer part number Project or product name File name of object code Date Name of operating system that formatted diskette Formatted capacity of diskette
NON-DISCLOSURE
On diskettes, the application program must be in Motorola's S-record format (S1 and S9 records), a character-based object file format generated by M6805 cross assemblers and linkers.
1. Macintosh is a registered trademark of Apple Computer, Inc. 2. MS-DOS is a registered trademark of Microsoft Corporation. 3. PC-DOS is a trademark of International Business Machines Corporation.
General Release Specification Ordering Information For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Ordering Information ROM Program Verification
NOTE:
Begin the application program at the first user ROM location. Program addresses must correspond exactly to the available on-chip user ROM addresses as shown in the memory map. Write $00 in all non-user ROM locations or leave all nonuser ROM locations blank. Refer to the current MCU ordering form for additional requirements.Freescale may request pattern re-submission if nonuser areas contain any nonzero code.
If the memory map has two user ROM areas with the same addresses, then write the two areas in separate files on the diskette. Label the diskette with both filenames.
Freescale Semiconductor, Inc...
In addition to the object code, a file containing the source code can be included. Freescale keeps this code confidential and uses it only to expedite ROM pattern generation in case of any difficulty with the object code. Label the diskette with the filename of the source code.
14.5 ROM Program Verification
The primary use for the on-chip ROM is to hold the customer's application program. The customer develops and debugs the application program and then submits the MCU order along with the application program. Freescale inputs the customer's application program code into a computer program that generates a listing verify file. The listing verify file represents the memory map of the MCU. The listing verify file contains the user ROM code and may also contain nonuser ROM code, such as self-check code. Freescale sends the customer a computer printout of the listing verify file along with a listing verify form. To aid the customer in checking the listing verify file, Freescale will program the listing verify file into customer-supplied blank preformatted Macintosh or DOS disks. All original pattern media are filed for contractual purposes and are not returned. Check the listing verify file thoroughly, then complete and sign the listing verify form and return the listing verify form to Freescale. The signed listing verify form constitutes the contractual agreement for the creation of the custom mask.
MC68HC05RC17 -- Rev. 2.0 Ordering Information For More Information On This Product, Go to: www.freescale.com General Release Specification
NON-DISCLOSURE
AGREEMENT
REQUIRED
Freescale Semiconductor, Inc. Ordering Information REQUIRED 14.6 ROM Verification Units (RVUs)
After receiving the signed listing verify form, Freescale manufactures a custom photographic mask. The mask contains the customer's application program and is used to process silicon wafers. The application program cannot be changed after the manufacture of the mask begins. Freescale then produces 10 MCUs, called RVUs, and sends the RVUs to the customer. RVUs are usually packaged in unmarked ceramic and tested to 5 Vdc at room temperature. RVUs are not tested to environmental extremes because their sole purpose is to demonstrate that the customer's user ROM pattern was properly implemented. The 10 RVUs are free of charge with the minimum order quantity. These units are not to be used for qualification or production. RVUs are not guaranteed by Freescale Quality Assurance.
Freescale Semiconductor, Inc...
AGREEMENT
14.7 MC Order Numbers
Table 14-1 shows the MC order numbers for the available package types. Table 14-1. MC Order Numbers
Package Type 28-Pin Plastic Dual In-Line Package (DIP) 28-Pin Small Outline Integrated Circuit Package (SOIC) Operating Temperature Range 0 C to 70 C 0 C to 70 C MC Order Number MC68HC05RC17P MC68HC05RC17DW
NON-DISCLOSURE
General Release Specification Ordering Information For More Information On This Product, Go to: www.freescale.com
MC68HC05RC17 -- Rev. 2.0
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
For More Information On This Product, Go to: www.freescale.com
Freescale Semiconductor, Inc.
Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 (800) 521-6274 480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku Tokyo 153-0064, Japan 0120 191014 +81 2666 8080 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate, Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 (800) 441-2447 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor @hibbertgroup.com
RoHS-compliant and/or Pb- free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb- free counterparts. For further information, see http://www.freescale.com or contact your Freescale sales representative. For information on Freescale.s Environmental Products program, go to http://www.freescale.com/epp.
Freescale Semiconductor, Inc...
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part.
For More Information On This Product, Go to: www.freescale.com
HC05RC17GRS/D


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